SAN DIEGO--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, will be exhibiting at both the IMAPS HiTEC Electronics and CS ManTech conferences the week of May 7, 2018. StratEdge will be highlighting the latest packaging technology for high-temperature applications, including Si, GaAs, and GaN devices, at HiTEC and the latest high-reliability package families at CS ManTech.
StratEdge will be at IMAPS HiTEC Electronics, Albuquerque, New Mexico on May 8 and 9th in booth 12, and at CS ManTech, Austin, Texas, from May 7-9, in booth 112.
“StratEdge packages have been popular for their heat dissipating properties and high-reliability for over 20 years,” explained Tim Going, president of StratEdge, “but with a continued emphasis on lowering power and pushing the capabilities of chips to deliver ever-higher frequencies, these packages are truly critical. Attending these shows enables us to work with engineers to build packages that enable proper functioning of their chips.”
Photo available at: http://stratedge.com/stratedge-at-imaps-hitec-cs-mantec.png
StratEdge designs and manufactures high-performance semiconductor packages and provides chip assembly and test services. We specialize in packages for high-frequency, very high power, extremely demanding Gallium Arsenide (GaAs) and Gallium Nitride (GaN) devices and have a complete line of post-fired and molded ceramic semiconductor packages that operate from DC to 50+ GHz. Our patented electrical transition designs give StratEdge packages exceptionally low electrical losses, even at 63+ GHz. Markets served include telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, and MEMS. StratEdge is an ISO 9001:2008 facility.