Complete Teardown of Sensirion's SGP30 Gas Sensor - 2018 Report - ResearchAndMarkets.com

DUBLIN--()--The "SGP30 Gas Sensor from Sensirion Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering.

This report analyzes Sensirion's entire component, including the package, MEMS, and ASIC die developed by the company. It also provides a full description of the ASIC and MEMS functionalities, and details the manufacturing processes used.

Sensirion, a leading manufacturer of digital microsensors and systems, recently released a gas sensor designed for consumer and appliance applications: the SGP30 Multi-Pixel. The SGP30 gas sensor is a new kind of sensor which measures different gas types in any environment. With a DFN package volume under 5.5 mm3, this gas sensor can be embedded in a variety of low-power systems, including smartphones, tablets, and laptops.

Boasting an innovative design based on metal oxide technology, the SGP30 is Sensirion's first multi-gas sensor. Enclosed in a small DFN 2.45 x 2.45 mm molded package, this sensor can be embedded in virtually any low-power system. Sensirion's Multi-Pixel technology focuses on detecting different gases like CO2 and VOCs on a common membrane, using multiple metal-oxide in the same component.

To reduce the component size, Sensirion placed the gas sensor above the ASIC and packaged it with the same mold compound, gaining certain advantages like a reduced number of bonds, and an increased signal-to-noise ratio. With specific material and layout choices, the SGP30 embeds the heater and electrodes within the ASIC.

Despite the high current and temperature generated, signal measurement is preserved from these disturbances. The electrode and heater are managed by the ASIC, which includes a temperature sensor for measuring the membrane's temperature, along with flash memory for data calibration.

A complete cost analysis and estimated sales price for the SGP30 gas sensor is included too, along with a comparison between ams' AS-MLV-P2, ams's CCS801 and Bosch's BME680 gas sensor.*

Key Topics Covered:

1. Overview /Introduction

2. Sensirion - Company Profile

3. Physical Analysis

Physical Analysis Methodology

Sensor Package

View and dimensions

Package Opening

Sensor Package Cross-Section

MEMS/ASIC Die

View, Dimensions, and Markings

Cross-Section: Metal Layers, Transistor, Capacitor

Die Metal De-processing

Die Delayering, Main Block ID, and Process

Die-Process Characteristics

Comparison with ams and Bosch

4. Manufacturing Process Flow

Wafer Fabrication Unit

Front-End Process

Final Assembly Unit

5. Cost Analysis

Cost Analysis Overview

Main Steps Used in the Economic Analysis

Yield Hypotheses

ASIC

Front-End Cost

MEMS

Front-End Cost

Back-End Cost

Packaging Cost

Component Cost

6. Selling Price

Companies Mentioned

  • Bosch
  • Sensirion

For more information about this report visit https://www.researchandmarkets.com/research/q7f8rc/complete_teardown?w=4

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
Related Topics: Gas and Chemical Sensors

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
Related Topics: Gas and Chemical Sensors