FREMONT, Calif.--(BUSINESS WIRE)--Optical Internetworking Forum (OIF) members approved revision 3.1 of the Common Electrical Interface (CEI) implementation agreement document (link to CEI document), which specifies the electrical characteristics of transmitters, receivers, and channels for interface speeds up to 28 Gb/s. The latest revision of this IA is key to addressing the challenges of 100G technology and includes two new clauses defining additional CEI-28G interfaces that are currently being implemented in products today by suppliers.
“The OIF has focused on keeping the CEI IA up-to-date and forward looking,” said David Stauffer, of Kandou and the OIF Physical and Link Layer working group chair and board member. “These new interface definitions are important as the industry is currently deploying 100G applications and needs to continually support faster and more cost-effective electrical interfaces to optical components.”
CEI-28G-VSR specifies a chip-to-module electrical interface for use in the range 19.6 Gsym/s to 28.1 Gsym/s, with up to 10 dB of loss and a single connector. This clause of the implementation agreement defines the characteristics required to communicate between an optical module and a host chip and meet interoperability requirements at the module connector. CEI-28G-VSR is the definitive module interconnection for the 28G generation and has been implemented by several optical module products.
CEI-28G-MR defines requirements for a chip-to-chip medium reach high-speed electrical interface between nominal baud rates of 19.90 Gsym/s and 28.1 Gsym/s with 20 dB of loss. Past work from the OIF found the need for a specification optimized for medium reach, shorter length backplane channels with lower loss. Transmitters and receivers optimized to meet CEI-28G-MR and used in medium reach applications will offer power advantages over components designed for higher loss backplanes. The CEI-28G-MR signals the completion of the 28G IAs.
New Project and Workshop Seek to Develop 56 Gb/s Requirements
The OIF is working on several electrical 56 Gb/s specifications that will enable higher density 100 and 400 Gb/s systems. These specifications will be suitable for use in both chip-to-module and chip-to-chip applications and are expected to play a key role in enabling the next generation of many different high-speed systems. The new project started during the Q1 meeting will address medium reach applications and is in addition to 56 Gb/s projects started for short reach interface applications.
Also at the quarterly meeting the OIF conducted a workshop on 56G that tackled next generation electrical link technology to support 400G. This workshop cultivated input from industry leaders on where 56G is heading and how to address the next generation applications. The OIF will continue to seek industry input as necessary for the success of 400G standards. It is anticipated that 400 Gb/s interfaces will require denser electrical links than current 28 Gb/s serial link technology.
Other news out of the quarterly meeting include elections for 2-year terms for Dave Stauffer, of Kandou as the OIF Physical and Link Layer Working Group chair and Ed Frlan, of Semtech as the OIF Physical and Link Layer Interoperability Working Group chair.
About the OIF
Launched in 1998, the OIF is the first industry group to unite representatives from data and optical networking disciplines, including many of the world's leading carriers, component manufacturers and system vendors. The OIF promotes the development and deployment of interoperable networking solutions and services through the creation of Implementation Agreements (IAs) for optical, interconnect, network processing, component and networking systems technologies. The OIF actively supports and extends the work of standards bodies and industry forums with the goal of promoting worldwide compatibility of optical internetworking products. Information on the OIF can be found at http://www.oiforum.com.