DUBLIN--(BUSINESS WIRE)--The "Global Fan-out Wafer Level Packaging Market 2021-2025" report has been added to ResearchAndMarkets.com's offering.
The publisher has been monitoring the fan-out wafer level packaging market and it is poised to grow by $1.60 billion during 2021-2025, decelerating at a CAGR of 14.29% during the forecast period.
This report on the fan-out wafer level packaging market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by the increased demand for compactly designed electronics and the growing use of semiconductor ICs in IoT.
The fan-out wafer level packaging market analysis includes the technology segment and geographic landscape. This study identifies the rapid adoption of FinFET technology as one of the prime reasons driving the fan-out wafer level packaging market growth during the next few years.
- Amkor Technology Inc.
- ASE Technology Holding Co. Ltd.
- Cypress Semiconductor Corp.
- Infineon Technologies AG
- JCET Group Co. Ltd.
- NXP Semiconductors NV
- Renesas Electronics Corp.
- Samsung Electronics Co. Ltd.
- Siliconware Precision Industries Co. Ltd.
- Taiwan Semiconductor Manufacturing Co. Ltd.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. This report on fan-out wafer level packaging market covers the following areas:
- Fan-out wafer level packaging market sizing
- Fan-out wafer level packaging market forecast
- Fan-out wafer level packaging market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The publisher's market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Key Topics Covered:
1. Executive Summary
- Market overview
2. Market Landscape
- Market ecosystem
- Value chain analysis
3. Market Sizing
- Market definition
- Market segment analysis
- Market size 2020
- Market outlook: Forecast for 2020 - 2025
4. Five Forces Analysis
- Bargaining power of buyers
- Bargaining power of suppliers
- Threat of new entrants
- Threat of substitutes
- Threat of rivalry
- Market condition
5. Market Segmentation by Technology
- Market segments
- Comparison by Technology
- High density - Market size and forecast 2020-2025
- Standard density - Market size and forecast 2020-2025
- Market opportunity by Technology
6. Customer landscape
- Customer landscape
7. Geographic Landscape
- Geographic segmentation
- Geographic comparison
- APAC - Market size and forecast 2020-2025
- North America - Market size and forecast 2020-2025
- Europe - Market size and forecast 2020-2025
- South America - Market size and forecast 2020-2025
- MEA - Market size and forecast 2020-2025
- Key leading countries
- Market opportunity By Geographical Landscape
- Market drivers
- Market challenges
- Market trends
8. Vendor Landscape
- Landscape disruption
9. Vendor Analysis
- Vendors covered
- Market positioning of vendors
For more information about this report visit https://www.researchandmarkets.com/r/t6o7c6