TOKYO--(BUSINESS WIRE)--ERS electronic, the innovation leader in thermal management solutions for the semiconductor industry, is slated to present at this year’s virtual SEMICON Japan. The presentation will be held by ERS’ key leaders Laurent Giai-Miniet and Klemens Reitinger. In addition to looking back at the company’s 50 year long history, the co-CEOs will give a comprehensive overview of the company’s latest thermal technologies for wafer probing. The audience will be given a closer look at some of ERS’ most remarkable capabilities, including temperature accuracy down to 50mK, thermal uniformity down to 0.1°C, and Ultra-Low Noise measurements on the femto-Ampere level. Viewing the presentation requires pre-registration, which can be done on SEMICON Japan’s website.
“It’s been 50 years since my uncle, Erich Reitinger, invented the first thermal chuck for wafer probing, so we wanted to take this opportunity to show our audience how far we’ve come since then”, CTO Klemens Reitinger. “Being able to do this at SEMICON Japan is particularly significant to us, since we have been attending this event for more than 20 years.”
“There are well-established equipment manufacturers in Japan, but we see an increasing demand for advanced thermal solutions associated with the rise of new applications in electromobility, autonomous driving, artificial intelligence (AI), 5G and the Internet of Things,” says CSMO Laurent Giai-Miniet. “This is where ERS comes into the picture, by providing specialized, customizable solutions that can tackle these thermal challenges.”
The company will also be exhibiting virtually together with its Japanese distribution partner, ONC Inc., who is providing sales and support services from its headquarters in Tokyo. The exhibition goes live on December 14th and closes on December 17th.
ERS electronic GmbH, based around Munich, has been producing innovative thermal test solutions for the industry for nearly 50 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate air cool-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS such as AC3, AirCool® PRIME, AirCool® and PowerSense® are integral components in all larger-sized wafer probers across the semiconductor industry.
For more information, please visit: www.ers-gmbh.com