Silicon on Insulator Market by Wafer Size, Wafer Type, Technology, Product, Application - Global Forecast to 2025 - ResearchAndMarkets.com

DUBLIN--()--The "Silicon on Insulator (SOI) Market by Wafer Size (200 mm and less than 200 mm, 300 mm), Wafer Type (RF-SOI, FD-SOI), Technology (Smart Cut, Layer Transfer), Product (RF FEM, MEMS), Application (Consumer Electronics, Automotive) - Global Forecast to 2025" report has been added to ResearchAndMarkets.com's offering.

The global SOI market size is projected to grow from USD 1.0 billion in 2020 to USD 2.2 billion by 2025, at a CAGR of 15.7% from 2020 to 2025.

The growth of the SOI industry can be attributed to the increase in investments by wafer manufacturers and foundry players in the SOI ecosystem.

However, the floating body and self-heating effects in SOI-based devices act as major restraints for the growth of the market. Growth in the integrated chip industry and expanding SOI ecosystem in APAC are expected to pose as growth opportunities for the SOI market during the forecast period. Effective maintenance of thickness uniformity of 200 mm and 300 mm wafers and other parameters acts as a major challenge for the growth of the SOI market across the globe.

The SOI market for 300 mm wafer size is projected to grow at a higher CAGR than the market for 200 mm and less than 200 mm wafer size during the forecast period.

Based on wafer size, the 300 mm segment of the SOI market is projected to grow at a higher CAGR than the 200 mm and less than 200 mm segments during the forecast period. Manufacturers of Radio Frequency (RF) chips, including Qualcomm Technologies, Inc. (US), Broadcom (US), Qorvo (US), Skyworks Solutions (US), and Murata Manufacturing (Japan) have undertaken several initiatives to increase their production of 300 mm wafers.

Moreover, wafer players are also expanding their 300 mm wafer manufacturing capacity. Foundries such as GlobalFoundries (US), TowerJazz (Israel), TSMC (Taiwan), and UMC (US) are also expanding their RF-SOI manufacturing processes for 300 mm wafers.

The FD-SOI wafer type segment of the SOI market is projected to grow at the highest CAGR during the forecast period.

FD-SOI wafer types are highly reliable in high-temperature environments. They have reduced operating voltage and are cost-effective, which leads to their increased demand across the globe. Moreover, developments undertaken by several key players have also contributed significantly to the demand for FD-SOI wafer types. For instance, in 2019, Soitec and KOKUSAI ELECTRIC CORPORATION expanded their strategic partnership through R&D collaboration at Substrate Innovation Center (France), aiming at strengthening the FD-SOI portfolio of Soitec for next-generation semiconductor devices. Moreover, Soitec signed a long-term supply agreement with GlobalFoundries to supply 300 mm SOI wafers to meet the growing demand for differentiated RF-SOI, FD-SOI, and silicon photonics technology platforms from the customers of GlobalFoundries.

The SOI market in APAC is projected to grow at the highest CAGR during the forecast period.

The SOI market in APAC is projected to grow at the highest CAGR during the forecast period. The growth of the market in this region can be attributed to the increased investments and continuous expansions being carried out by the manufacturers of semiconductor foundries, wafers, and products in APAC. For instance, in 2018, GlobalFoundries and the Chengdu Municipality signed an agreement to develop an efficient FD-SOI ecosystem for use in artificial intelligence and security products.

Market Dynamics

Drivers

  • Increased Investments in the SOI Ecosystem
  • Growth in Use of SOI Wafers in Consumer Electronics
  • Reduced Overall Cost of Semiconductor Devices by Minimizing Silicon Wastage During the Manufacturing of Thin SOI Wafers
  • Improved Performance Offered and Low Operating Voltage Required by SOI Wafers
  • Covid-19-Driven Drivers
  • Increased Focus on E-Learning to Increase Demand for Smartphones, Tablets, and Laptops

Restraints

  • Floating Body and Self-Heating Effects in SOI-Based Devices
  • Limited Availability of Existing Intellectual Property Ecosystems to Fabless Companies

Opportunities

  • Growing Integrated Chip Industry and Expanding SOI Ecosystem in Apac
  • Increasing Use of SOI Technology in Iot Devices and Applications
  • Covid-19-Driven Opportunities
  • Implementing Automation Solutions Across Retail Industry to Avoid Human Intervention

Challenges

  • Volatility and Susceptibility of SOI-Based Wafers to Damage Caused by Pressure Or Stress
  • Effective Maintenance of Thickness Uniformity and Other Parameters
  • Covid-19-Driven Challenges
  • Anticipated Shortage of Skilled Workforce in SOI Wafer Manufacturing Facilities

Companies Profiled

  • Soitec
  • Shin-Etsu Chemical Co., Ltd.
  • Globalwafers Co., Ltd.
  • Sumco
  • Simgui
  • Globalfoundries
  • STMicroelectronics N.V.
  • Towerjazz
  • Nxp Semiconductors N.V.
  • Murata Manufacturing
  • Skyworks Solutions
  • Qorvo
  • Sony Corporation
  • Magnachip Semiconductor
  • United Microelectronics Corporation
  • Taiwan Semiconductor Manufacturing Company
  • Qualcomm Technologies, Inc.
  • Silicon Valley Microelectronics, Inc.
  • Ev Group (Evg)
  • Ultrasil Llc
  • Siltronix Silicon Technologies
  • Waferpro

For more information about this report visit https://www.researchandmarkets.com/r/9e6gi2

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Press Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Press Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900