SAN JOSE, Calif.--(BUSINESS WIRE)--Spectra7 Microsystems Inc. (TSX:SEV) (“Spectra7” or the “Company”), a leading provider of high-performance analog semiconductor products for broadband connectivity markets and Foxconn Interconnect Technology, Ltd. (FIT), a leading supplier of interconnect solutions will be demonstrating
Active Copper Cable (ACC) interconnects supporting the new SFP-DD standard for higher speed and higher density server connections. The cables use Spectra7’s low-power analog GaugeChangerTM chips to enable 4X increase in bandwidth over currently deployed SFP28 interconnects in hyperscale and enterprise data centers. The companies will be showcasing this innovative solution at the DesignCon 2019 expo on January 31 thru February 1 in Santa Clara, California.
“Spectra 7 is a key technology partner for our high speed and high-density interconnect solutions,” said Yan Margulis, VP Sales and Marketing at FIT. “We believe that the demonstration at DesignCon will be well received by our customers.”
New interface standards such as SFP-DD and others are significantly increasing port density in data center switching and server systems but are also limiting the interconnect length that can be served by low-cost direct-attach copper (DAC) cables. Spectra7's GaugeChanger™ silicon allows copper cables up to three times the reach of passive copper cables.
Currently deployed SFP interconnects operate at 25-28 Gbps but will soon move to 56 Gbps PAM4 signaling. The new SFP-DD electrical interfaces are designed to support 2 lanes that operate up to 25 Gbps NRZ or 56 Gbps PAM4 per lane, providing solutions up to 50 Gbps or 112 Gbps PAM4 aggregate. By doubling the lane density and data speed of SFP transceivers, the SFP-DD specification addresses increased port density and scalability in next-generation applications.
“FIT is a leader in the data center interconnect market,” said Spectra7 CEO Raouf Halim. “This joint demonstration at 112 Gbps of SFP-DD is another major milestone as we continue to leverage our technology in the latest data center standards.”
GaugeChangerTM is an innovative and disruptive technology that allows copper to extend much longer lengths without the cost and power penalty of optics. It works equally well at 25 Gbps NRZ and 50 Gbps PAM-4 enabling new connector standards of 100, 200 and 400 Gbps.
FIT will be showcasing products with Spectra7’s GaugeChangerTM technology at Booth #700.
Spectra7 will be showcasing its GaugeChangerTM technology at Booth #307
ABOUT FOXCONN INTERCONNECT TECHNOLOGY, LIMITED ("FIT")
Foxconn Interconnect Technology, Limited focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components.
For more information, visit FIT's website: fit-foxconn.com/.
About Spectra7 Microsystems Inc.
Spectra7 Microsystems Inc. is a high-performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading electronics manufacturers in virtual reality, augmented reality, mixed reality, data centers and other connectivity markets. Spectra7 is based in San Jose, California with design centers in Cork, Ireland, and Little Rock, Arkansas. For more information, please visit www.spectra7.com.
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