LONDON--(BUSINESS WIRE)--According to the latest market research report released by Technavio, the global substrate-like PCB market is expected to accelerate at a CAGR of over 7% during the forecast period. The need for miniaturization and more efficient interconnect solutions is one of the key factors triggering the growth of the market.
This research report titled ‘Global Substrate-like PCB Market 2018-2022’ provides an in-depth analysis of the market in terms of revenue and emerging market trends. It also includes an up-to-date analysis and forecasts for various market segments and all geographical regions.
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The market research analysis categorizes the global substrate-like PCB market into the following applications:
- Communication
- IoT
In 2017, the communication segment accounted for 73.46% of the global market and is projected to reach 74.13% by 2022, exhibiting almost 0.67% increase in market share.
Global substrate-like PCB market: Top emerging trend
The increasing outsourcing of activities in the semiconductor industry is an emerging trend in the substrate-like PCB market. Previously, the semiconductor industry was characterized by the presence of companies that designed, fabricated, packaged, and tested ICs in-house, But, at present, many semiconductor companies are going fabless by only designing chips while outsourcing fabrication, packaging, and testing to other companies.
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Technavio’s sample reports are free of charge and contain multiple sections of the report including the market size and forecast, drivers, challenges, trends, and more.
Technavio’s report provides expert market research on the following topics:
Executive Report
- Market Outline
- Global Substrate-like PCB Market Overview
Market Insights
- Market Sizing and Forecasts
- Market Growth
- Market Drivers and Challenges
- Key Emerging Trends
Market Segmentation Analysis
- Regional comparison (APAC, Americas, and EMEA)
- Key leading countries
- Market segmentation by application (communication and IoT)
Vendor Landscape
- Vendor classification
- Market positioning of vendors
- Competitive scenario
- Analysis of top vendors (AT&S, IBIDEN, Kinsus, Samsung Electro-Mechanics, Unimicron)
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