LONDON--(BUSINESS WIRE)--The global semiconductor assembly and packaging services market 2018-2022 report has been added to Technavio’s semiconductor equipment research library. According to Technavio’s market research analysts, the market is expected to grow at a CAGR of nearly 5% during the forecast period.
This research report provides actionable insights to help you answer key questions surrounding the emerging trends, drivers, and challenges, that are projected to impact the global semiconductor assembly and packaging services market and its stakeholders over the forecast years.
This report is available at a USD 1,000 discount for a limited time only: View market snapshot before purchasing
Technavio’s report provides expert market research on the following topics:
- Market Outline
- Global Semiconductor Assembly and Packaging Services Market Overview
- Market Sizing and Forecasts
- Market Growth
- Market Drivers and Challenges
- Key Emerging Trends
Market Segmentation Analysis
- Regional comparison (APAC, Americas, and EMEA)
- Key leading countries
- Market segmentation by application (communication sector, computing and networking sector, industrial and automotive sector, and consumer electronics sector)
- Vendor classification
- Market positioning of vendors
- Competitive scenario
- Analysis of top vendors (ASE, Amkor Technology, Intel, SAMSUNG ELECTRONICS, SPIL, and TSMC)
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Technavio’s sample reports are free of charge and contain multiple sections of the report including the market size and forecast, drivers, challenges, trends, and more.
Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.
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