DUBLIN--(BUSINESS WIRE)--The "Global Advanced Packaging Market - Segmented by Technology & Region - Growth, Trends and Forecasts (2018 - 2023)" report has been added to ResearchAndMarkets.com's offering.
The global advanced packaging market was valued at USD 3,358.1 million in 2017, and it is expected to reach a value of USD 6,254.6 million by 2023, at a CAGR of 10.5% during the forecast period 2018-2023.
The industry has always been witnessing constant transitions, miniaturization of nodes and increasing size of wafers owing to the ULSI fabrication are driving the market growth. Increasing number of manufacturers offering innovative products are increasing as the companies are focused toward R&D. Growing consumer electronic users and consumer preference toward smaller, lighter and thinner products, with increased demand for tablets, smartphones and other connected devices, along with the increasing need for advanced architecture in electronic products, are also fueling the growth of this market.
Innovations in the semiconductor packaging technology are majorly based on the size of the wafer, thereby raising focus on the wafer-level packages, which has resulted in innovative packaging solutions in the chip industry. Manufacturers are keenly focused on the production of larger diameter wafers owing to the increasing demand. The Fan out sub-segment technology is an emerging alternative solution to the 2.5D packaging, it can also handle multiple dies when compared to the fan-in wafer-level packaging, which can handle single die only.
Companies Mentioned
- Amkor Technology Inc.
- Taiwan Semiconductor Manufacturing Company
- STATS ChipPAC Ltd
- Advanced Semiconductor Engineering Inc.
- United Microelectronics Corporation
- Semiconductor Manufacturing International Corporation
Key Topics Covered:
1. Introduction
2. Research Approach and Methodology
3. Executive Summary
4. Market Dynamics
5. Global Advanced Packaging Market Segmentation
6. Competitive Intelligence - Company Profiles
7. Investment Analysis
8. Future Outlook of the Advanced Packaging Market
For more information about this report visit https://www.researchandmarkets.com/research/jnzmmn/global_advanced?w=4
