LONDON--(BUSINESS WIRE)--Technavio’s latest report on the global inclinometers market provides an analysis of the most important trends expected to impact the market outlook from 2017-2021. Technavio defines an emerging trend as a factor that has the potential to significantly impact the market and contribute to its growth or decline.
The research study by Technavio on the global inclinometers market for 2017-2021 provides a detailed industry analysis based on application (construction, automotive, and consumer electronics) and geography (APAC, EMEA, and the Americas).
The global inclinometers market size is projected to grow to USD 3.09 billion by 2021. The construction sector is the leading segment of the global market, generating over 32% of the overall revenue. Inclinometers are used by forestry professionals, surveyors, and construction firms for angle measurement activities, thereby driving the market growth.
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The top three emerging trends driving the global inclinometers market according to Technavio hardware and semiconductor research analysts are:
- Increased adoption of smart lifestyle wearable devices
- Advanced MEMS packaging
- Growing demand for sensors in smart factories
Increased adoption of smart lifestyle wearable devices
“The adoption of smart lifestyle wearable devices has been on the rise, with consumers in the developed nations opting for wearable devices to enhance their lifestyle. For instance, devices such as Google Glass and the Nod ring are witnessing high rates of adoption by consumers seeking to streamline their daily activities,” says Sunil Kumar Singh, a lead analyst at Technavio for embedded systems research.
Additionally, with the increase in awareness about health-monitoring applications, end-users are more inclined to purchase devices that have multiple functions. This is prompting manufacturers to innovate and develop new products, which are integrated with inclinometers.
Advanced MEMS packaging
Evolution of the micro electro mechanical systems (MEMS) in the packaging industry is resulting in a rising requirement to reduce packaging size and integrate 9-axis sensors in a single package. Also, it is crucial for vendors to achieve standardization in packaging to increase the unit shipments of MEMS sensors. Certain vendors in the market are trying to achieve standardization in packaging materials for various sensors by adopting low-temperature wafer bonding, packing MEMS at wafer dicing level, and doped polysilicon and silicon interposers for packaging.
Growing demand for sensors in smart factories
“The number of smart factories has witnessed a global rise, leading to rising significance of robotic factories and automation of entire factory floors. Inclinometers are widely adopted by these smart factories to increase the flexibility and efficiency to reduce assembly and processing time, thereby increasing the plant utilization capacity,” says Sunil.
Inclinometers are used in smart factories in the form of clinometers and gradiometers, inclinometers sensors and accelerometers, and digital liquid crystal display (LCD) inclinometers. This is expected to drive the market for inclinometers in the forecast period.
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