TAIPEI, Taiwan--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc (ASE, TAIEX:2311, NYSE:ASX), the leading provider of semiconductor assembly and test services, today announced that its Chung Li, Taiwan facility has received the ISO 26262 certification from TÜV NORD, a technical service provider that helps companies to validate the safety of products and services. ISO 26262 is a standard related to the safety of electrical and electronic systems within a car and addresses possible hazards caused by malfunctioning behavior of safety-related systems, including interaction of these systems.1
‘The increasing number of electronic functions in an automotive vehicle has added to the complexity in automotive manufacturing. Such complexity also adds to the increased need for the IC assembly manufacturing process to adhere to strict automotive benchmarks and practices in order to achieve zero ppm in automotive testing. Zero ppm creates a mindset that strives to guarantee quality and reliability to ensure that vehicles are safe and dependable,’ says TS Chen, President of ASE Chung Li. ‘ASE has invested time, financial and human resources to train its engineers to identify and manage risks within the manufacturing process and to avoid these risks by providing appropriate requirements and processes as outlined in the ISO 26262 standards,’ he continued.
The ASE Chung Li site has been in the forefront of automotive IC assembly and testing, providing many of the industry’s top tier automotive device players with packaging solutions for almost two decades. The facility is also TS 16949 certified and continues to improve its quality and safety standards by undertaking global certification programs. The ISO 26262 certification will greatly benefit customers and ASE as both parties would be able to shorten the time needed to verify the functional safety of all products and enable customers to reach their intended markets quickly.
Heterogeneous integrated package solutions such as ASE’s System-in-Package, MEMS and sensor module solutions are robust technologies developed for the myriad and sophisticated electronics that make automotive vehicles smarter and safer. In an industry that innovates non-stop, ASE is poised to grow its IC packaging portfolio and technology capability as well as the adoption of international safety and quality standards for the future in connected and autonomous cars.
About The ASE Group
The ASE Group is among the leading providers of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co., Ltd. and its subsidiaries, members of the ASE Group. For more information about the ASE Group, visit www.aseglobal.com.
Safe Harbor Notice
This press release contains "forward-looking statements" within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended, including statements regarding our future results of operations and business prospects. Although these forward-looking statements, which may include statements regarding our future results of operations, financial condition or business prospects, are based on our own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward-looking statements, which apply only as of the date of this press release. The words “anticipate, “believe,” “estimate,” “expect,” “intend,” “plan” and similar expressions, as they relate to us, are intended to identify these forward-looking statements in this press release. Our actual results of operations, financial condition or business prospects may differ materially from those expressed or implied in these forward-looking statements for a variety of reasons, including risks associated with cyclicality and market conditions in the semiconductor or electronic industry; changes in our regulatory environment, including our ability to comply with new or stricter environmental regulations and to resolve environmental liabilities; demand for the outsourced semiconductor packaging, testing and electronic manufacturing services we offer and for such outsourced services generally; the highly competitive semiconductor or manufacturing industry we are involved in; our ability to introduce new technologies in order to remain competitive; international business activities; our business strategy; our future expansion plans and capital expenditures; the uncertainties as to whether we can complete the acquisition of 100% of Siliconware Precision Industries Co., Ltd. shares not otherwise owned by ASE; the strained relationship between the Republic of China and the People’s Republic of China; general economic and political conditions; the recent global economic crisis; possible disruptions in commercial activities caused by natural or human-induced disasters; fluctuations in foreign currency exchange rates; and other factors. For a discussion of these risks and other factors, please see the documents we file from time to time with the Securities and Exchange Commission, including our 2015 Annual Report on Form 20-F filed on April 29, 2016.
1 Source: Semiengineering online, Knowledge Center, ISO 26262.