Global Semiconductor Packaging and Assembly Equipment Market 2016-2020 - Key Vendors are Applied Materials, ASMPT, DISCO, EVG, Kulicke & Sofa Industries, TEL & Tokyo Seimitsu - Research and Markets

DUBLIN--()--Research and Markets (http://www.researchandmarkets.com/research/k4ks6q/global) has announced the addition of the "Global Semiconductor Packaging and Assembly Equipment Market 2016-2020" report to their offering.

The report predicts that the global semiconductor packaging and assembly equipment market will grow at a CAGR of 4.68% during the period 2016-2020.

The global semiconductor packaging and assembly equipment market is observing an increase in the number of M&A. New entrants in the market are taking the M&A route to enter the already highly competitive market. Existing vendors are also turning to M&A to expand their market shares and help them enhance their market position.

According to the report, the adoption of polymer adhesive wafer bonding equipment is increasing due to higher-quality packaging of vertically stacked and 3D ICs. Further, the boom in the IoT device market and increased adoption of ICs in automotive products will likely drive the demand for semiconductor ICs and their associated packaging and assembly equipment during the next few years.

Further, the report states that Fluctuations in foreign exchange rates will affect the rates of semiconductor packaging and assembly equipment.

The market is divided into the following segments based on type:

  • Die-level packaging and assembly equipment
  • Wafer-level packaging and assembly equipment

Key vendors:

  • Applied Materials
  • ASMPT
  • DISCO
  • EVG
  • Kulicke and Soffa Industries
  • TEL
  • Tokyo Seimitsu

Other prominent vendors:

  • Rudolph Technologies
  • SEMES
  • Suss Microtec
  • Ultratech
  • Ulvac Technologies

Key Topics Covered:

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Market research methodology

PART 04: Introduction

PART 05: Technology landscape

PART 06: Market landscape

PART 07: Market segmentation by type

PART 08: Geographical segmentation

PART 09: Market drivers and their impact

PART 10: Market challenges

PART 11: Impact of drivers and challenges

PART 12: Market trends

PART 13: Vendor landscape

PART 14: Key vendor analysis

PART 15: Key suggestions for investors/vendors

For more information visit http://www.researchandmarkets.com/research/k4ks6q/global

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Semiconductor

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Semiconductor