DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/52jvzl/samsung_galaxy_s6) has announced the addition of the "Samsung Galaxy S6 Teardown & Physical Analyses of Key Components - Reverse Technology Report" report to their offering.
The Samsung Galaxy S6 holds many IC components which are listed and reviewed in the report. A special focus has been made to highlight the component structure and understand the manufacturing process on 11 notable components among 4 selected topics: Advanced packaging, MEMS/Sensor, RF and Imaging.
Five MEMS/Sensors components
- Fingerprint sensor - second generation
- eCompass - new reference which has never been used in a smartphone and smallest eCompass on the market
- OIS gyroscope - smallest gyroscope on the market
- Heart-rate monitor sensor and color, ambient light and proximity sensor - rarely integrated in a smartphone
Imaging components
- Front and rear camera modules as well as flash LED
Two packaging components
- Samsung Exynos Processor - advanced Package-on-Package (PoP) structure
- Samsung power management IC - smallest pitch Wafer-Level Package (WLP) on the board
One RF component
- Wi-Fi & Bluetooth combo module - flip-chip BGA SiP integrating the industry's most powerful 5G WiFi combo chip
Key Topics Covered:
1. Executive Summary
- High Resolution Pictures
- ICs Identification
- ICs Identification (mfr., ref., fcn., pkg. type, size & pin count)
- Unknown Components Decapsulation
- Repartition by package type
- Mfr. Design wins ranking
- ICs footprint ranking
- PCB Characteristics
- PCB Cross-Section
- PCB min. line width
2. Advanced Packaging
- Samsung Exynos PoP
- Package views & dimensions
- Package Cross-Section
- Package Opening
- Processor & DRAM dies measurement
- Samsung smallest pitch WLP
- Package views & dimensions
- Package Cross-Section
3. MEMS/Sensors
- Fingerprint Sensor
- Button Assembly View
- Fingerprint sensor views & dimensions
- Fingerprint sensor Cross-Section
- Sensor die measurement
- 3-Axis eCompass
- Package views & dimensions
- Package Cross-Section
- Die measurement
- Sensor Details
- OIS Gyroscope
- Assembly in camera module
- Package views & dimensions
- Package Opening & Die measurement
- MEMS opening & sensor details
- Cross-Section
- Pulse Oximetry & Heart-Rate Monitor Sensor
- Package views & dimensions
- Package Opening & Die measurement
- Color, ALS and Proximity Sensor
- Package views & dimensions
- Package Opening & Dies measurement
4. RF Devices
- 5G Wi-Fi & Bluetooth Combo Chip
- Package views & dimensions
- Package Opening & Dies measurement
5. Camera Modules & Flash LED
- 16Mp Rear Camera Module
- Module views & dimensions
- Module Opening & CIS die measurement
- Module Cross-Section
- 5Mp Front Camera Module
- Module views & dimensions
- Module Opening & CIS die measurement
- Module Cross-Section
- Flash LED
- Package views & dimensions
- Package Opening & LED die measurement
For more information visit http://www.researchandmarkets.com/research/52jvzl/samsung_galaxy_s6.
