Research and Markets: Global System On Package (SOP) Market 2015-2020 - By Technology Elements, by Application and by Geography

DUBLIN--()--Research and Markets (http://www.researchandmarkets.com/research/8f3pg7/system_on_package) has announced the addition of the "System On Package (SOP) Market - By Technology Elements (Electrical Silicon Through-Vias, Fine Pitch, High Bandwidth Wiring And Others), By Application (Consumers Electronics, Wireless Communication) And By Geography (2015-2020)" report to their offering.

SOP (System On Package) is a technology that places an entire system with computing, communications, and consumer functions all in a single chip. This technology is forecast to enable lower cost, more efficient and higher performance electronic systems. SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip.

SOP report categorizes the market into three different segments, namely, market by type of technology elements, application, and geography. Based on the technology elements, the market has been classified into Electrical Silicon through-vias, Fine-Pitch, High Bandwidth Wiring, Fine-Pitch Solder Interconnection, Fine-Pitch Known-good-Die and Advanced Microchannel Cooling. The applications include Consumer electronics and wireless communications. Based on the geography, the report has been segmented into North America, Europe, APAC, and RoW.

Key Topics Covered:

1. Global SOP (SOP) Market - Market Overview

2. Executive Summary

3. Global SOP Market - Market Landscape

4. Global SOP Market - Strategic Analysis

5. Global SOP Market - by Technology Elements

6. Global SOP Market - by Application

7. Global SOP Market- By Geography

8. Global SOP - Market Entropy

9. Company Profiles (Overview, Financials, SWOT Analysis, Developments, Product Portfolio)

10. Appendix

Companies Mentioned

  • IBM Corporation
  • ABB Ltd.
  • Rockwell Automation, Inc.
  • Honeywell International Inc.
  • Cooper Industries plc
  • Emerson Electric Co.
  • Hollysys Automation Technologies Ltd
  • Thomas & Betts Corporation
  • Thales Group
  • RSTAHL, Inc.
  • NHP Electrical Engineering Products
  • E2S Warning Signals
  • WERMA SIGNALTECHNIK GMBH + CO.KG
  • JAuer Signalgerate GmbH

For more information visit http://www.researchandmarkets.com/research/8f3pg7/system_on_package

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Computing and Technology

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Computing and Technology