SUNNYVALE, Calif.--(BUSINESS WIRE)--Unisem, a global provider of semiconductor assembly and test services, today announced that it will be exhibiting at the following conferences this Fall:
- MEMS Industry Group’s Shanghai 2014 Conference on Sept 11 in Shanghai, China.
- iMAPS 47th International Symposium on Microelectronics on Oct 14-15 in San Diego, CA.
- 2014 MEPTEC Semiconductor Packaging Technology Symposium on Oct 23 in Santa Clara, CA.
- International Wafer-Level Packaging Conference on Nov 12-13 in Santa Clara, CA.
The company will also participate in IEEE-CPMT’s ESTC 2014: 5th Electronics System-Integration Technology Conference on Sept 16-18 in Helsinki, Finland but will not be exhibiting.
Unisem is a global provider of semiconductor assembly and test (OSAT) services for many of the world's most successful electronics companies. We offer an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding; a wide range of leadframe and substrate IC packaging; wafer level CSP; and RF, analog, digital, and mixed signal test. Our turnkey services include design, assembly, test, failure analysis, and electrical, mechanical, and thermal characterization and modeling. Unisem is an established MEMS OSAT with several years of experience in volume consumer and automotive production, in addition to a broad package portfolio covering multiple applications. The company has factory locations in Ipoh, Malaysia; Chengdu, People's Republic of China; Batam, Indonesia; and Sunnyvale, USA. Unisem is headquartered in Kuala Lumpur, Malaysia.