Research and Markets: InvenSense MPU-9250 9-Axis MEMS IMU Reverse Costing Analysis

DUBLIN--()--Research and Markets (http://www.researchandmarkets.com/research/jtn223/invensense) has announced the addition of the "InvenSense MPU-9250 9-Axis MEMS IMU Reverse Costing Analysis" report to their offering.

For its second generation of 9 DoF sensor, InvenSense manages to integrate a 6-Axis Accelerometer/Gyroscope and a 3-Axis Magnetometer in a cost effective QFN package of only 3x3mm (45% footprint reduction compared to the previous generation).

This package reduction has been made possible thanks to a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefice of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.

The MPU-9250 also integrates a new 3-Axis magnetometer from AKM, the AK8963, which features almost 40% size reduction compared to previous generation and sensitivity improvement with 0.15µT/LSB.

Key Topics Covered

Glossary

Overview/Introduction , Companies Profile

Physical Analysis

  • Package
  • MPU-6500 Die
  • AK8963 Die

Comparison with previous generation

Manufacturing Process Flow

- MPU-6500 ASIC Front-End Process

- MPU-6500 MEMS Process Flow

- AK8963 ASIC Front-End Process

- AK8963 Magnetic Concentrator Process Flow

- Wafer Fabrication Units

- Packaging Process Flow & Assembly Unit

Cost Analysis

- Main steps of economic analysis

- Yields Hypotheses

- MPU-6500 ASIC Front-End Cost

- MPU-6500 MEMS Front-End Cost

- MPU-6500 MEMS Front-End Cost per process steps

- MPU-6500 Total Front-end Cost

- MPU-6500 Back-End 0 : Probe Test & Dicing

- MPU-6500 Wafer & Die Cost

- AK8963 ASIC Front-End Cost

- AK8963 Magnetic Concentrator Cost

- AK8963 Total Front-end Cost

- AK8963 Back-End 0 : Probe Test & Dicing

- AK8963 Wafer & Die Cost

- Back-End : Packaging Cost

- Back-End : Packaging Cost per Process Steps

- Back-End : Final Test & Calibration Cost

- MPU-9250 Component Cost

Estimated Price Analysis

For more information visit http://www.researchandmarkets.com/research/jtn223/invensense

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Sector: Advanced Technology

Contacts

Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Advanced Technology