TOKYO--(BUSINESS WIRE)--Advantest Corporation (TSE: 6857, NYSE: ATE) today announced that it has developed a new EB (electron beam) lithography system, the F7000, with superior resolution performance meeting the requirements for 1Xnm technology nodes. The F7000 supports substrates of diverse materials, sizes, and shapes, including nanoimprint templates as well as wafers, and is optimized for diverse applications such as advanced LSIs, photonics, MEMS, and other nano-processes.
The F7000 will be featured in Advantest’s exhibit (booth #3D-803 in Hall 3) at the SEMICON Japan trade show, December 5-7 in Makuhari Messe in the Chiba prefecture. The company plans to launch sales of the new system in the fiscal year ending March 2014.
A Flexible Next-Generation Lithography Solution
Competition in the mobile electronics and other categories has sparked an urgent need for chip-makers to develop increasingly low-power, highly functional semiconductors while reducing TTM (time to market). As a result, manufacturers are looking to EB lithography, which writes fine-pitch patterns directly onto wafers, as a method of accelerating cutting-edge semiconductor R&D processes. Advantest’s new F7000 offers the company’s proven EB technology in a system capable of writing patterns as fine as 1Xnm. The system also supports template fabrication for nanoimprint lithography—a technology positioned to take center stage in next-generation semiconductor manufacturing.
Product Features
1Xnm Resolution Performance
Advantest has developed a new column technology—key to electron beam writing accuracy—which delivers resolution performance meeting the needs of cutting-edge semiconductor R&D at the 1Xnm node.
Supports Substrates of Diverse Sizes, Shapes, & Materials
The F7000’s adjuster function enables it to write to diverse sizes of wafer, glass substrates, and also square substrates. Moreover, simply by switching adjusters, the system can support silicon, gallium arsenide, and substrates of other materials, utilizing separate adjusters for each material to avoid contamination.
“Lab to Fab” Flexible Configuration
Users can select the configuration optimal for their needs, either stand-alone or in-line, enabling the F7000 to support a wide array of applications from R&D to volume production.
High Throughput
With increased current density, the F7000 achieves a write speed fully 5 times faster than its predecessor model, the F3000.
Small Footprint
The F7000 features a footprint 40% smaller than that of the F3000.
| Key Specifications | ||
| Resolution: | 1Xnm | |
| Substrates supported for lithography: | Wafers (300mm, 200mm, 3-6in.) | |
| Glass substrates (6025) | ||
About Advantest Corporation
A world-class technology company, Advantest is the leading producer of automatic test equipment (ATE) for the semiconductor industry and a premier manufacturer of measuring instruments used in the design and production of electronic instruments and systems. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also focuses on R&D for emerging markets that benefit from advancements in nanotech and terahertz technologies, and has recently introduced multi-vision metrology scanning electron microscopes essential to photomask manufacturing, as well as a groundbreaking 3D imaging and analysis tool. Founded in Tokyo in 1954, Advantest established its first subsidiary in 1982, in the USA, and now has subsidiaries worldwide. More information is available at www.advantest.com.
All information supplied in this release is correct at the time of publication, but may be subject to change.