Trade Show News
Stay updated with the latest trade show news through detailed press releases. Learn about upcoming events, key highlights, and industry trends. Get insights into significant trade show announcements, exhibitor information, and post-event analyses.
Sep 21, 2026 at 7:24 AM
fJscaler Announces Sampling of Breakthrough 100 GHz BiCMOS TIA for Next-Generation AI and Cloud Datacenter Optical Interconnects
MÁLAGA, Spain--(BUSINESS WIRE)--fJscaler, Inc., an innovator in high-performance analog and photonic semiconductors for optical interconnects, today announced at ECOC 2026 that it has begun sampling to strategic customers its BiCMOS transimpedance amplifier (TIA) for intensity-modulation direct-detection (IM-DD) applications. Designed for next-generation optical interconnects powering AI and cloud datacenters, the device delivers an unprecedented combination of energy efficiency, sensitivity, a...
Sep 21, 2026 at 5:07 AM
Lumentum, Qualcomm, and Corning to Demonstrate High-Density 1060 nm VCSEL Optical D2D Connectivity for AI Scale-Up at ECOC 2026
MALAGA, Spain--(BUSINESS WIRE)--Lumentum Holdings Inc. (“Lumentum”) today announced plans for a joint demonstration together with Qualcomm Technologies, Inc. and Corning Incorporated (NYSE: GLW) of a high-density die-to-die (D2D) optical interconnect showcase for AI scale-up architectures at ECOC 2026. The board-level demonstration will combine a D2D interface IP subsystem from Qualcomm Technologies with Lumentum’s VCSEL-based optical interconnect platform and Corning multimode fiber connectivi...
Sep 21, 2026 at 2:30 AM
Semtech Enables 50G Optical Transition for AI-Driven 5G-Advanced
CAMARILLO, Calif.--(BUSINESS WIRE)--Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, today announced full production availability of its mobile transport portfolio enabling 50G fronthaul for the next wave of 5G-Advanced radio deployments. The announcement aligns with the industry’s transition to 50G optical interfaces, marked by Ericsson’s Mobile W...
Sep 21, 2026 at 2:00 AM
Teradyne Introduces Iris 100: Production-Proven Test System for MicroLED Devices
NORTH READING, Mass.--(BUSINESS WIRE)--Teradyne Iris 100 is a production-ready test platform for microLED devices used in optical data interconnects in AI data centers....
Sep 21, 2026 at 1:01 AM
TeraSignal and Keysight to Demonstrate CMIS Link Training at OIF Booth #2126 During ECOC 2026
IRVINE, Calif.--(BUSINESS WIRE)--TeraSignal will demonstrate CMIS Link Training (CMIS-LT) with Keysight Technologies as part of the OIF interoperability demonstrations at ECOC 2026....
Sep 21, 2026 at 1:00 AM
Marvell to Showcase Industry-First 2nm Optical Technology Demos for AI Data Center Infrastructure at ECOC 2026
SANTA CLARA, Calif.--(BUSINESS WIRE)--Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced industry-first 2nm optical interconnect demonstrations that advance the next generation of AI data center connectivity. The technologies will be showcased at the European Conference on Optical Communication (ECOC) 2026, September 20–24, 2026, in Málaga, Spain, underscoring how Marvell continually delivers new waves of advanced connectivity solut...
Sep 21, 2026 at 12:33 AM
2026 World Manufacturing Convention Opens in Hefei, Spotlighting New Opportunities for Global Intelligent Manufacturing Cooperation
HEFEI, China--(BUSINESS WIRE)--The 2026 World Manufacturing Convention is being held in Hefei, Anhui Province, from September 20 to 23. Under the theme “Intelligent Manufacturing for a Better Future,” the convention has attracted more than 1,000 government and business representatives and over 500 international delegates. More than 40 multinational companies from the United States, France, Russia and other countries are exhibiting in groups to explore new opportunities for intelligent manufactu...
Sep 21, 2026 at 12:00 AM
Lessengers Unveils Breakthrough 3.2T Glass-Substrate Near-Packaged Optics (NPO) Powered by Direct Optical Wiring (DOW) Technology
SEOUL, South Korea & MÁLAGA, Spain--(BUSINESS WIRE)--Lessengers, a pioneer in advanced optical interconnect solutions, today announced a major architectural milestone for high-performance computing (HPC) with the unveiling of its 3.2T glass-substrate near-packaged optics (NPO) platform at ECOC 2026 in booth 2184 at FYCMA in Malaga, Spain. Powered by the company’s proprietary direct optical wiring (DOW) technology, this new 3.2 Terabits-per-second (Tbps) architecture bypasses traditional packagi...
Sep 20, 2026 at 9:00 PM
UVJC to Launch NovaJet at WESEMiBAY as Semiconductor Industry Looks Beyond Traditional Scaling
SINGAPORE--(BUSINESS WIRE)--UVJC, a wholly owned subsidiary of UDC, today announced it will introduce NovaJet at WESEMiBAY 2026 in Shenzhen, China....
Sep 20, 2026 at 8:00 PM
Trilliant Returns to Enlit Asia 2026 with a Focus on Flexible, Future-Ready Grid Modernization
JAKARTA, Indonesia--(BUSINESS WIRE)--Trilliant returns to Enlit Asia 2026 as Diamond Sponsor for the 8th consecutive year, backed by 40 years of innovation and 13M+ smart meters in APAC....
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