Trade Show News

Stay updated with the latest trade show news through detailed press releases. Learn about upcoming events, key highlights, and industry trends. Get insights into significant trade show announcements, exhibitor information, and post-event analyses.

Sep 21, 2026 at 9:07 AM

OMNIVISION Announces New TheiaCel™ Image Sensor with Industry-Leading LED Flicker Mitigation in Exterior Automotive Cameras

SANTA CLARA, Calif.--(BUSINESS WIRE)--OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog and display technology, today announced its new OX08D30 8-megapixel CMOS automotive image sensor with TheiaCel™ technology, designed for advanced driver assistance systems (ADAS) and autonomous driving (AD) exterior cameras. The OX08D30 further extends single-exposure dynamic range to mitigate LED flicker and other temporal sampling artifacts, resul...
Sep 21, 2026 at 9:00 AM

Hexcel to Showcase Advanced Composite Innovations for Aerospace, Defense and Space at CAMX 2026

STAMFORD, Conn.--(BUSINESS WIRE)--Hexcel Corporation (NYSE: HXL), a global leader in advanced composites technology, will showcase new materials, qualification milestones and manufacturing innovations at the Composites and Advanced Materials Expo (CAMX) 2026, Sept. 22-24 in Atlanta. Visitors to Hexcel's Booth P4 will learn how the company is helping customers accelerate the development and production of next-generation aircraft, strengthen defense and space capabilities, and benefit from the ad...
Sep 21, 2026 at 8:00 AM

Climate Science in Action: Building a More Resilient Grid for the Future

ROSEMEAD, Calif.--(BUSINESS WIRE)--Today at Climate Week NYC, Edison International released Adapting Today: Energizing a More Resilient Tomorrow, an overview of climate-related threats facing the energy grid and the actions and collaborations needed to prepare for them. The paper details how Southern California Edison is leveraging advanced climate data to uncover vulnerabilities and guide efforts to strengthen infrastructure, meet increased energy demand and support a reliable, affordable elec...
Sep 21, 2026 at 8:00 AM

Establishment Labs® Highlights New Breast Tissue Preservation Data and Announces Minimally Invasive Product Extensions at the 11th World Symposium on Ergonomic Implants

NEW YORK--(BUSINESS WIRE)--Establishment Labs Holdings Inc. (NASDAQ: ESTA), a global medical technology company dedicated to improving women’s health and wellness, principally in breast aesthetics and reconstruction, announced the presentation of new clinical and scientific data supporting Breast Tissue Preservation and its Minimally Invasive Platform. Establishment Labs also announced the product line extensions of both Mia® and Preservé™ with new sizes and supporting tools. The announcements...
Sep 21, 2026 at 7:24 AM

fJscaler Announces Sampling of Breakthrough 100 GHz BiCMOS TIA for Next-Generation AI and Cloud Datacenter Optical Interconnects

MÁLAGA, Spain--(BUSINESS WIRE)--fJscaler, Inc., an innovator in high-performance analog and photonic semiconductors for optical interconnects, today announced at ECOC 2026 that it has begun sampling to strategic customers its BiCMOS transimpedance amplifier (TIA) for intensity-modulation direct-detection (IM-DD) applications. Designed for next-generation optical interconnects powering AI and cloud datacenters, the device delivers an unprecedented combination of energy efficiency, sensitivity, a...
Sep 21, 2026 at 5:07 AM

Lumentum, Qualcomm, and Corning to Demonstrate High-Density 1060 nm VCSEL Optical D2D Connectivity for AI Scale-Up at ECOC 2026

MALAGA, Spain--(BUSINESS WIRE)--Lumentum Holdings Inc. (“Lumentum”) today announced plans for a joint demonstration together with Qualcomm Technologies, Inc. and Corning Incorporated (NYSE: GLW) of a high-density die-to-die (D2D) optical interconnect showcase for AI scale-up architectures at ECOC 2026. The board-level demonstration will combine a D2D interface IP subsystem from Qualcomm Technologies with Lumentum’s VCSEL-based optical interconnect platform and Corning multimode fiber connectivi...
Sep 21, 2026 at 2:30 AM

Semtech Enables 50G Optical Transition for AI-Driven 5G-Advanced

CAMARILLO, Calif.--(BUSINESS WIRE)--Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, today announced full production availability of its mobile transport portfolio enabling 50G fronthaul for the next wave of 5G-Advanced radio deployments. The announcement aligns with the industry’s transition to 50G optical interfaces, marked by Ericsson’s Mobile W...
Sep 21, 2026 at 2:00 AM

Teradyne Introduces Iris 100: Production-Proven Test System for MicroLED Devices

NORTH READING, Mass.--(BUSINESS WIRE)--Teradyne Iris 100 is a production-ready test platform for microLED devices used in optical data interconnects in AI data centers....
Sep 21, 2026 at 1:01 AM

TeraSignal and Keysight to Demonstrate CMIS Link Training at OIF Booth #2126 During ECOC 2026

IRVINE, Calif.--(BUSINESS WIRE)--TeraSignal will demonstrate CMIS Link Training (CMIS-LT) with Keysight Technologies as part of the OIF interoperability demonstrations at ECOC 2026....
Sep 21, 2026 at 1:00 AM

Marvell to Showcase Industry-First 2nm Optical Technology Demos for AI Data Center Infrastructure at ECOC 2026

SANTA CLARA, Calif.--(BUSINESS WIRE)--Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced industry-first 2nm optical interconnect demonstrations that advance the next generation of AI data center connectivity. The technologies will be showcased at the European Conference on Optical Communication (ECOC) 2026, September 20–24, 2026, in Málaga, Spain, underscoring how Marvell continually delivers new waves of advanced connectivity solut...
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