OKI Publishes Technical Journal Featuring “Innovations utilizing Edge Platforms”

- Introducing examples of technologies and solutions suited to the field to address various social issues -

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) today published an English edition of OKI Technical Review (Note 1), Issue 243. The theme of this issue’s special feature is “Innovations utilizing Edge Platforms.” The coverage introduces specific examples of technologies and solutions suited to the field to address a wide range of social issues.

OKI has announced the concept of Edge Platform as part of its technology strategy. It is a technological concept that expands the value provided by sophisticating edge devices deployed in the field based on “robustness” and connecting or linking data.

Kurato Maeno, Executive Officer, Chief Technology Officer, and Head of the Technology Division describes how robustness represents a core competence that allows OKI to deliver the unstoppable/unceasing solutions essential to maintain reliable and convenient social infrastructures, a strength OKI has cultivated over many years. He goes on to explain that based on this strength, OKI is working to resolve social issues through its capabilities in Creation & Manufacturing, Connectivity, and Continuity & Resilience.

This special feature highlights case studies and initiatives that utilize OKI’s technological capabilities based on robustness and showcases innovations made possible by Edge Platforms.

The contents of this issue are as follows:

Introducing New Technologies and Products

• Sensing Technology for Automatically Tracking Location of Objects in Warehouses
• Development of Bi-Directional CDN for Beyond 5G Video Services
• Development of Underwater Acoustic Communication for Underwater Networks
• Printing Technology to Improve Efficiency and Support Module Expansion
• Manufacturing Method of Printed Wiring Board with High Heat Dissipation
• Thermal Analysis of Rocket-Mounted Enclosures - Simulation of Unsteady Heat Transfer in Vacuum Environment -
• Stacked Integration of Analog ICs using "Thin Film Chiplets" by crystal film bonding (CFB)
• Miniaturization of Distributed Optical Fiber Sensor

[Terminology]
Note 1: Technical journal published to showcase the OKI Group technical development achievements and present the latest products in clear, easy-to-understand language

[Related link]
OKI Technical Review: https://www.oki.com/global/otr/

About Oki Electric Industry (OKI)

Founded in 1881, OKI is Japan's leading information and telecommunication manufacturer. Headquartered in Tokyo, Japan, OKI provides top-quality products, technologies, and solutions to customers through its Public Solutions, Enterprise Solutions, Component Products, and Electronics Manufacturing Services businesses. Its various business divisions function synergistically to bring to market exciting new products and technologies that meet a wide range of customer needs in various sectors. Visit OKI's global website at https://www.oki.com/global/.

Notes:
- Oki Electric Industry Co., Ltd. is referred to as "OKI" in this document.
- The names of the companies and products mentioned in this document are the trademarks or registered trademarks of the respective companies and organizations.