JetCool to Unveil Groundbreaking Liquid Cooling Solution for NVIDIA H100 GPUs at Supercomputing Conference 2023

Solution will help drive performance, efficiency, and reliability, enabling advances in high-performance computing and AI

LITTLETON, Mass.--(BUSINESS WIRE)--JetCool Technologies Inc. (JetCool), an innovator in advanced liquid cooling solutions, is thrilled to announce its participation in the Supercomputing Conference taking place from November 12 to 17, 2023 in Denver, Colorado. Attendees can visit JetCool at booth #1781 to witness firsthand the launch of its revolutionary liquid cooling technology, designed for NVIDIA’s H100 GPUs.

Continuing its leadership in liquid cooling, JetCool’s low-profile, high-performance H100 SmartPlate module drives unparalleled performance and efficiency, maximizing rack density in high-performance computing environments.

“Our team is excited to showcase our latest liquid cooling innovation at this year’s Supercomputing Conference,” said Dr. Bernie Malouin, CEO of JetCool. “The H100 GPU from NVIDIA is a powerhouse for AI and high-performance computing, and we believe our new liquid cooling solution will unlock its full potential, ensuring optimal performance, efficiency, and reliability.”

The low-profile cooling module is designed to seamlessly integrate with NVIDIA’s H100 GPUs, providing exceptional thermal management while maintaining a compact form factor to maximize space efficiency in data centers. By enhancing performance and eliminating thermal constraints, JetCool’s liquid cooling technology enables organizations to achieve higher rack densities, resulting in a more efficient and powerful computing infrastructure.

Key features of the H100 SmartPlate cooling module include:

• Optimized thermal performance for NVIDIA H100 GPUs
• Compact design to maximize rack space utilization
• Enhanced reliability and longevity of GPU components

The low-profile cooling module is scheduled for availability in Q1 2024, with JetCool committed to providing ongoing support and innovation to meet the evolving needs of the high-performance computing community.

Visit JetCool at booth #1781 at the Supercomputing Conference to experience liquid cooling for the now-term and learn how JetCool is setting new standards in performance and efficiency.

About JetCool

JetCool is catalyzing breakthroughs in thermal management for compute-intensive applications. The company's liquid cooling solutions provide the essential foundation for semiconductor manufacturers, hyperscalers, and their partners to advance innovations in high-performance computing. Deployed by major chipmakers and OEMs, JetCool’s state-of-the-art liquid cooling solutions ensure sustained advancements in device efficiency, performance, reliability, and sustainability. With over $20 million USD in investments from renowned entities in tech, semiconductor, and venture sectors such as Bosch and DuPont, JetCool continues to uphold its commitment to a forward-thinking mission. For additional information, please visit jetcool.com.