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Samenvatting: HTEC en Modular breiden MAX en Mojo naar Google TPU uit, waardoor AI Hardware Enablement van jaren naar maanden wordt teruggebracht

PALO ALTO, Calif.--(BUSINESS WIRE)--HTEC, een internationaal AI-first engineering- en technologieservicesbedrijf, en Modular hebben een demonstratie gegeven van de AI-softwarestack van Modular die op Google's TPU-architectuur draait. Dit werk, voorgesteld tijdens ModCon 2026, toont aan dat ondersteuning voor een nieuwe processortarget kan worden geleverd door een bestaande softwarebasis uit te breiden in plaats van die voor elke versneller opnieuw op te bouwen. Het project bracht Modular's MAX-...
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HTEC und Modular erweitern MAX und Mojo auf Google TPU und verkürzen so die Zeit bis zur Einsatzbereitschaft von KI-Hardware von Jahren auf Monate

PALO ALTO, Kalif.--(BUSINESS WIRE)--HTEC, ein weltweit tätiges, auf KI ausgerichtetes Unternehmen für Ingenieurs- und Technologiedienstleistungen, und Modular haben den KI-Software-Stack von Modular auf der TPU-Architektur von Google demonstriert. Die auf der ModCon 2026 vorgestellte Präsentation zeigt, dass die Unterstützung für eine neue Hardwareplattform durch die Erweiterung einer bestehenden Software-Grundlage erreicht werden kann, anstatt diese für jeden Beschleuniger neu zu entwickeln. I...
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HTEC et Modular enrichissent Google TPU avec MAX et Mojo, réduisant ainsi le délai de prise en charge matérielle de l'IA de plusieurs années à quelques mois

PALO ALTO, Californie--(BUSINESS WIRE)--HTEC, société internationale de services d'ingénierie et de technologies AI-first, et Modular ont présenté la pile logicielle d'IA de Modular fonctionnant sur l'architecture TPU de Google. Présentés lors de la ModCon 2026, ces travaux démontrent la faisabilité de la prise en charge d'une nouvelle cible de silicium en élargissant un socle logiciel existant plutôt que de le reconstruire pour chaque accélérateur. Ce projet a permis d'intégrer l'écosystème MA...
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Resumen: HTEC y Modular amplían MAX y Mojo a Google TPU, reduciendo el tiempo necesario para la implementación de hardware de IA de años a meses

PALO ALTO, California--(BUSINESS WIRE)--HTEC, una empresa internacional de servicios de ingeniería y tecnología centrada en la IA, y Modular han demostrado el funcionamiento de la pila de software de IA de Modular en la arquitectura TPU de Google. Presentado en ModCon 2026, este trabajo demuestra que es posible ofrecer compatibilidad con un nuevo objetivo de silicio ampliando una base de software ya existente, en lugar de tener que reconstruirla para cada acelerador. El proyecto logró trasladar...
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Riassunto: HTEC e Modular portano MAX e Mojo all'architettura TPU di Google, riducendo i tempi di implementazione dell'hardware per l'IA da anni a mesi

PALO ALTO, California--(BUSINESS WIRE)--HTEC, un'azienda globale di servizi di ingegneria e tecnologici basati sull'IA, e Modular hanno dimostrato lo stack software di intelligenza artificiale di Modular in esecuzione sull'architettura TPU di Google. Presentato in occasione di ModCon 2026, questo lavoro dimostra che il supporto per un nuovo target di silicio può essere fornito mediante l'estensione di una base software esistente anziché ricostruendolo per ciascun acceleratore. Il progetto ha av...
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KBRA Releases Research – The Geography of Auto Loan ABS Performance

NEW YORK--(BUSINESS WIRE)--KBRA releases research examining state-level auto loan ABS performance across the U.S. Most auto ABS transactions are geographically diversified, limiting the impact of any single state on overall deal performance. However, geographic differences may be more relevant for whole-loan buyers and for securitizations with outsized concentrations in states performing meaningfully above or below expectations, particularly when those concentrations differ from a shelf’s histo...
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IQVIA Announces Offering of Senior Notes

RESEARCH TRIANGLE PARK, N.C.--(BUSINESS WIRE)--IQVIA Holdings Inc. (“IQVIA”) (NYSE:IQV) today announced that its wholly owned subsidiary, IQVIA Inc. (the “Issuer”), intends to raise $2,000,000,000 through an offering of senior notes due 2034 (the “Notes”). The proceeds from the Notes offering will be used to redeem in full the Issuer’s Senior 5.000% Notes due 2026, to repay a portion of the outstanding indebtedness under the Issuer’s revolving credit facility and to pay fees and expenses relate...
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Toyota and Rivian Adopt Stratasys' New F870™ to Accelerate Factory-Floor Manufacturing Applications at Scale

MINNETONKA, Minn. & REHOVOT, Israel--(BUSINESS WIRE)--Stratasys Ltd. (NASDAQ: SSYS) announced the launch of the new F870™ FDM® system, a large-format additive manufacturing platform designed for industrial manufacturers, automotive OEMs, aerospace & defense production lines, looking to scale production on the factory floor.Extending the Stratasys production-grade FDM portfolio, the F870 combines unrivaled large-format capabilities in a heated chamber backed by a suite of the strongest, most...
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Aspen Federal Credit Union Launches Mahalo’s Digital Banking Platform

TROY, Mich.--(BUSINESS WIRE)--Aspen Federal Credit Union Launches Mahalo’s Digital Banking Platform...
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Alcoa Corporation Announces Proposed Debt Offering to Finance Cash Consideration for Acquisition of South32’s Bauxite, Alumina and Aluminum Assets

PITTSBURGH--(BUSINESS WIRE)--Alcoa Corporation (NYSE:AA, ASX:AAI) (“Alcoa”) announced today a proposed offering of $2,600,000,000 aggregate principal amount of senior notes (the “notes”), consisting of senior notes due 2034 to be issued by Alumina Pty Ltd (ABN 85 004 820 419) (“Alumina”) and senior notes due 2036 to be issued by Alcoa Nederland Holding B.V. (together with Alumina, the “Issuers”). Each of the Issuers is a wholly-owned subsidiary of Alcoa. The notes will be guaranteed on a senior...