SANTA CLARA, Calif.--(BUSINESS WIRE)--Intevac, Inc. (Nasdaq:IVAC) today announced that company management will participate in the 9th Annual CEO Investor Summit 2017, taking place Wednesday, July 12th, in San Francisco, California.
About The 9th Annual CEO Summit
The CEO Summit is an accredited investor and publishing research analyst event held concurrently with SEMICON West and Intersolar 2017 in San Francisco. The event is hosted by executive management from participating companies and will feature a “round-robin” format consisting of small group meetings, each 30 minutes in duration. During the event, investors and analysts will have the opportunity to meet with up to 10 of the 18 management teams during the 30-minute group meeting sessions, as well as opportunities to meet with additional management teams during the breakfast and lunch networking sessions.
The 18 management teams collectively hosting the 2017 CEO Summit include: Aehr Test (AEHR), Axcelis (ACLS), BE Semiconductor Industries (BESI.AS), Brooks (BRKS), Cabot Micro (CCMP), Camtek (CAMT), Cohu (COHU), CyberOptics (CYBE), Electro Scientific (ESIO), FormFactor (FORM), Ichor Systems (ICHR), inTEST (INTT), Intevac (IVAC), Kulicke & Soffa (KLIC), Nanometrics (NANO), Rudolph (RTEC), Soitec (SOIT), and Ultra Clean Technology (UCTT). Sponsoring the networking luncheon is Cowen & Co.
The CEO Investor Summit is by invitation only and is open to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is July 7, 2017.
While held concurrently with SEMICON West and Intersolar 2017, the event is not affiliated with the show.
RSVP Contacts for 9th Annual CEO Summit 2017
To RSVP for the CEO Summit, please contact either of the Summit’s co-chairs.
|Laura J. Guerrant-Oiye||Claire E. McAdams|
|Guerrant Associates||Headgate Partners LLC|
|Phone: (808) 960-2642||Phone: (530) 265-9899|
Intevac was founded in 1991 and has two businesses: Thin-film Equipment and Photonics.
In our Thin-film Equipment business, we are a leader in the design and development of high-productivity, thin-film processing systems. Our production-proven platforms are designed for high-volume manufacturing of substrates with precise thin film properties, such as the hard drive media, display cover panel, and solar photovoltaic markets we serve currently.
In our Photonics business, we are a recognized leading developer of advanced high-sensitivity digital sensors, cameras and systems that primarily serve the defense industry. We are the provider of integrated digital imaging systems for most U.S. military night vision programs.
For more information call 408-986-9888, or visit the Company's website at www.intevac.com.