Lattice Semiconductor Expands CrossLink Programmable ASSP (pASSP) IP Solutions

Latest IP, Development Platforms and Resources Enable New Video Bridging Capabilities Supporting a Variety of MIPI Interfaces

  • Expands use cases to foster development of innovative new video bridging applications using the latest generation processors, displays and sensors
  • Design flexibility, unique programmability and high performance of CrossLink make it ideal for broad markets including consumer, industrial and automotive
  • Designs based on CrossLink IP use up to 40% less logic than previous versions with reduced power consumption while enabling more functionality

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Learn more about Lattice's CrossLink pASSP and its new 4:1 MIPI CSI-2 camera aggregator bridge, ideal for drones, AR/VR, 360 cameras, and other automotive and industrial solutions.

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PORTLAND, Ore.--()--Lattice Semiconductor Corporation (NASDAQ:LSCC), the leading provider of customizable smart connectivity solutions, today announced the expansion of its Lattice CrossLink™ programmable ASSP (pASSP) solutions to enable new video bridging capabilities with the release of three new CrossLink intellectual property (IP) and two new CrossLink demonstration platforms showcasing MIPI® DSI to LVDS and CMOS to MIPI CSI-2. Reinforcing Lattice’s commitment to provide bridging solutions for consumer, industrial, and automotive applications, the company has optimized existing CrossLink IP to save logic resources and lower power consumption.

The CrossLink product was designed to address the challenges of today’s rapidly changing I/O landscape by offering designers a new way to develop high performance, low power and compact bridging solutions. Since the product introduction less than a year ago, Lattice has seen strong interest from customers to expand beyond typical early applications of the CrossLink product for simple interface conversion, merging and muxing of image sensors, application processors and displays.

By optimizing existing IP, leveraging new IP and development platforms, along with additional resources, Lattice can offer more solutions for a greater variety of bridging applications that captures the best of both worlds with the combined the flexibility and fast time to market of an FPGA and the power and functional optimization of an ASSP.

“The new CrossLink IP and solutions will enable our customers to adopt cameras and displays with the latest mobile interface technology to reduce overall system cost, power and size, while accelerating the design cycle of their next-generation products,” said C.H. Chee, senior director of marketing, mobile & consumer division at Lattice Semiconductor. “As inventors of the first programmable bridging device, and the world’s fastest MIPI D-PHY bridging device, Lattice is committed to delivering a low cost bridging solution with the highest bandwidth, lowest power and smallest footprint.”

Key features of the new CrossLink pASSP IP solutions include:

New IPs

New Technology Demonstration Platforms

  • CMOS to MIPI CSI-2 Camera Bridging Demonstration
    • Connects a popular image sensor with MIPI DPI CMOS-type pixel bus to the CSI-2 input on the application processor
    • MIPI DSI to LVDS display bridging demonstration
    • Connects the applications processor to a Dual Link LVDS display
  • MIPI DSI to LVDS Interface Bridging Demonstration
    • Connects mobile application processors to large format LVDS displays
    • Demonstrates the ability for industrial displays to interface to high volume, high performance mobile Application Processors.

Additional Resources

CrossLink evaluation boards with the new IPs are available now from Lattice and its distributors. To learn more, please visit www.latticesemi.com/CrossLink.

About Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) provides smart connectivity solutions powered by our low power FPGA, video ASSP, 60 GHz millimeter wave, and IP products to the consumer, communications, industrial, computing, and automotive markets worldwide. Our unwavering commitment to our customers enables them to accelerate their innovation, creating an ever better and more connected world.

For more information about Lattice please visit www.latticesemi.com. You can also follow us via LinkedInTwitterFacebookYouTube or RSS.

Lattice Semiconductor Corporation, Lattice Semiconductor (& design), and CrossLink and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

MIPI is a licensed trademark of MIPI, Inc. in the U.S. and other jurisdictions.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.

Contacts

MEDIA CONTACTS:
Lattice Semiconductor
Sherrie Gutierrez, 408-826-6752
sherrie.gutierrez@latticesemi.com
or
Racepoint Global
Deanna Meservey, 617-624-3415
Lattice@racepointglobal.com
or
INVESTOR CONTACT:
Global IR Partners
David Pasquale, 914-337-8801
lscc@globalirpartners.com

Release Summary

Lattice announces the expansion of its CrossLink™ pASSP solutions to enable new video bridging capabilities with the release of 3 new CrossLink IP and 2 new CrossLink demonstration platforms.

Contacts

MEDIA CONTACTS:
Lattice Semiconductor
Sherrie Gutierrez, 408-826-6752
sherrie.gutierrez@latticesemi.com
or
Racepoint Global
Deanna Meservey, 617-624-3415
Lattice@racepointglobal.com
or
INVESTOR CONTACT:
Global IR Partners
David Pasquale, 914-337-8801
lscc@globalirpartners.com