BOSCH Sensortec's BMF055: The Industry's First Custom-Programmable 9-Axis Motion Sensor - Technology and Cost Comparison Report - Research and Markets

DUBLIN--()--Research and Markets has announced the addition of the "BOSCH Sensortec BMF055: Technology and Cost Comparison" report to their offering.

Like its competitor InvenSense, BOSCH Sensortec has unveiled a programmable all-in-one motion sensor for robotics, gaming, and household IoT devices, touted as the industry's first custom-programmable 9-axis motion sensor.

The BMF055 is a new version of the BOSCH Sensortec 9-axis device (3-axis Gyroscope + 3-axis Accelerometer + 3-axis Magnetometer), with a MCU included in the package. Compared to the stand-alone sensor hub, this new approach eliminates a package and reduces system-level power. This device integrates six-chip in a complex System-in-Package.

The sensor hub combines a 14-bit accelerometer, a 16-bit gyroscope, and a geomagnetic sensor with a 32-bit ARM Cortex M0+ core. Compared to rivals, BOSCH Sensortec targets a broader range of customer applications with a high precision-sensor and dedicated MCU.

With BOSCH Sensortec's approach, the MEMS sensor and the ASIC are fabricated separately. Final assembly entails wire bonding of all parts . The BMF055 is shipped in a 5.8×3.2×1.15mm LGA package, a footprint that's larger than the competition.

This report features a detailed technology and cost comparison with the leading-edge sensor hub from InvenSense, highlighting the different choices from the two different designers.

Key Topics Covered:

Overview / Introduction

Bosch Company Profile

Physical analysis

- Package

-- Package characteristics: view, dimensions, and opening

-- Package cross-section

- ASIC Dies

-- View, dimensions, and markings

-- Delayering and main blocks ID

-- Cross-section

-- Process characteristics

- MEMS Dies

-- View, dimensions, and markings

-- Bond pad opening and bond pad

-- MEMS cap removed and details

-- Sensing area details

-- MEMS cross-section

-- MEMS process characteristics

- MCU Die

-- View, dimensions, and markings

-- Delayering and main blocks ID

-- Process and die cross-section

-- Die process characteristics

- Magnetometer Die

-- View, dimensions, and markings

-- Hall sensor and fluxgate sensor

-- Delayering and main blocks ID

-- Process and die cross-section

-- Die process characteristics

Manufacturing Process Flow

- Global overview

- ASIC front-end process

- MEMS process flow

- Magnetometer process flow

- ASIC, MEMS, and MCU wafer fabrication unit

- Packaging process flow and assembly unit

Cost Analysis

- Main steps of economic analysis

- Yields hypotheses

- ASIC & MCU front-end cost

- ASIC & MCU back-end 0: probe test and dicing

- ASIC & MCU wafer & die cost

- MEMS front-end cost

- MEMS front-end cost per process steps

- MEMS back-end 0: probe test and dicing

- MEMS wafer and die cost

- Magnetometer CMOS front-end cost

- Magnetometer sensor cost

- Magnetometer sensor cost per process steps

- Magnetometer back-end 0: probe test and dicing

- Magnetometer wafer and die cost

- Back-end: packaging cost

- Back-end: packaging cost per process steps

- Back-end: final test cost

- Component cost and price

Cost & price comparison with InvenSense ICM-30630 6-Axis Sensor Hub

For more information visit http://www.researchandmarkets.com/research/jkfdqv/bosch_sensortec

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
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For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Sensors

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Sensors