LISLE, Ill.--(BUSINESS WIRE)--Molex, a leading global manufacturer of electronic solutions, announced today the acquisition of Interconnect Systems, Inc. (“ISI”) which specializes in the design and manufacture of high density silicon packaging with advanced interconnect technologies.
According to Tim Ruff, senior vice president, Molex, the acquisition enables Molex to offer a wider range of fully integrated solutions to customers worldwide. “We are excited about the unique capabilities and technologies the ISI team brings to Molex. ISI’s proven expertise in high-density chip packaging strengthens our platform for growth in existing markets and opens doors to new opportunities.”
Headquartered in Camarillo, California, ISI delivers advanced packaging and interconnect solutions to top-tier OEMs in a wide range of industries and technology markets, including aerospace & defense, industrial, data storage and networking, telecom, and high performance computing. ISI uses a multi-discipline customized approach to improve solution performance, reduce package size, and expedite time-to-market for customers.
“We are thrilled to join forces with Molex. By combining respective strengths and leveraging their global manufacturing footprint, we can more efficiently and effectively provide customers with advanced technology platforms and top-notch support services, while scaling up to higher volume production,” said Bill Miller, president, ISI.
About Molex:
Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, industrial, automotive, commercial vehicle and medical. For more information, please visit www.molex.com.
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Molex is a registered trademark of Molex LLC in the United States of America and may be registered in other jurisdictions.
