FLANDERS, N.J.--(BUSINESS WIRE)--Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced that Michael P. Plisinski, the Company’s chief executive officer, and Steven R. Roth, chief financial officer, will participate in the 4th Annual Midtown CAP Investor Summit 2015, being held December 10, 2015 at the Le Parker Méridien Hotel, New York, NY.
The presentation material utilized during the conference will be made accessible on the investor page of Rudolph Technologies’ website at www.rudolphtech.com.
About the Midtown CAP Summit
The Midtown CAP Summit is hosted by executive management from the following participating companies: Aehr Test Systems (AEHR), Axcelis (ACLS), Advanced Energy Industries (AEIS), Brooks Automation (BRKS), Camtek Ltd (CAMT), Cascade Micro (CSCD), Cohu (COHU), Electro Scientific (ESIO), FormFactor (FORM), inTEST (INTT), Intevac (IVAC), Mattson Technology (MTSN), Nanometrics (NANO), Rudolph Technologies (RTEC), Ultra Clean Technology (UCTT), Ultratech (UTEK), Veeco Instruments (VECO) and Xcerra Corporation (XCRA), and will feature a “round-robin” format consisting of a series of small group meetings. The conference is not webcast.
The Midtown CAP Summit is by invitation only and is open to accredited investors and publishing research analysts. Hosts reserve the right to limit attendance as necessary. To RSVP for the Midtown CAP Summit, please contact the event’s co-chairs:
|Laura J. Guerrant-Oiye||Claire E. McAdams|
|Guerrant Associates||Headgate Partners LLC|
|Phone: (808) 882-1467||Phone: (530) 265-9899|
About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and data analysis systems and software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. The Company’s expanding portfolio of equipment and software provides comprehensive solutions for front-end wafer processing, final manufacturing and advanced packaging of ICs. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.