DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/cjr4sz/thermal_interface) has announced the addition of the "Thermal Interface Pads & Material Market by Type, Products, Application - Forecast to 2020" report to their offering.
The global thermal interface pads & material market is estimated to reach at $1379.02 million by 2020, at a CAGR of 8.47% from 2015 to 2020
The PCM market is expected to grow at a highest CAGR; its growth is expected to be driven by consumer electronics and telecom equipment industries.
The thermal interface pads & material market comprises various products used for transferring heat from electronic components to heat sinks in a wide range of electronic applications across different industries. Thermal interface pads & materials are widely used in consumer electronics, telecom equipment, power supply units, and others. This report segments the said market based on type, product, application, and geography. The report entails the analyses and forecasts related to the thermal interface pads & material market.
Based on the type of materials used, the thermal interface pads & material market has been classified into phase change material, thermal pads, thermal grease, and others. The said market has been segmented on the basis of application into consumer electronics, telecom equipment, power supply units, and others.
The market has been segmented based on geography into North America, Europe, Africa, APAC, and RoW. APAC is currently the largest market for thermal interface pads & material markets and is expected to exhibit a high growth rate in the next seven years.
Some of the prominent companies in this market include 3M (U.S.), Dow Corning (U.S.), Parker Chomerics (U.S.), and Laird Technologies (U.K.).
Key Topics Covered:
1 Introduction
2 Research Design
3 Executive Summary
4 Premium Insides
5 Market Overview
6 Industry Trends
7 Thermal Interface Material Market, By Type
8 Thermal Interface Pads Market, By Material Type
9 Thermal Interface Material Market, By Product
10 Thermal Interface Pads Market, By Application
11 Thermal Interface Materials Market, By Geography
12 Competitive Landscape
13 Company Profiles
- 3M
- DOW Corning
- Fujipoly
- Graftech International Holdings Inc.
- Henkel AG
- Honeywell International Inc.
- Laird Technologies
- Parker Hannifin Corp
- Stockwell Elastomerics, Inc.
- The Bergquist Company
For more information visit http://www.researchandmarkets.com/research/cjr4sz/thermal_interface
