SEOUL, South Korea--(BUSINESS WIRE)--Dongbu HiTek today announced that it has increased the volume production of touch screen controller (TSC) chips with embedded flash (eFlash) memory to meet the demand of fabless customers targeting both low and mid-range segments of the smart phone market. Fast becoming the technology of choice where low leakage current and high power efficiency are essential, the Korean foundry’s specialized eFlash process at the 0.13-micron node, is also ideal for implementing high-performance microcontroller unit (MCU) chips.
“We aim to expand our collaboration with multiple fabless customers now targeting the smart phone market,” said Jae Song, Dongbu HiTek EVP of Marketing. “We anticipate that our eFlash process will be gainfully deployed to implement TSC chips for tablet computers as well as MCU chips.” He noted that his company’s relatively new eFlash process owes its high data retention rate and disturbance-free performance to experience gained in manufacturing NOR flash memory chips over the past decade.
Embedded Flash Design Advantages
Compatible with low-voltage logic, Dongbu HiTek’s advanced eFlash process operates both core and I/O at 1.5V/3.3V (or 8V/18V optionally) and specifies low standby leakage current, typically 1uA. Various eFlash Macro IP (offered at no charge) supports non-volatile memory densities of 16, 32, 64, 128, and 256 Kbytes. Additional savings accrue during chip development with a built-in test mode to reduce test time and a stable macro IP yield as well as optional Cu wire bonding.
TSC and MCU Market Opportunities
According to Gartner, the market for both low and mid-range phones that typically sell from under $100 up to $300 is forecast to grow from about 650 million units this year to more than 920 million units in 2017, representing a CAGR of more than 12 percent. Meanwhile, iSuppli sees the market opportunity for TSC chips targeting smart phones and tablet computers to remain fairly steady at about $1.6 billion from 2014 through 2016, while the market for MCU chips grows from some $16 billion this year to about 18 billion in 2016, representing a CAGR of around 6 percent.
About Dongbu HiTek
Dongbu HiTek Co., Ltd. specializes in developing superb analog and mixed-signal processing technologies. The company adds high value to advanced ICs with a processing portfolio that encompasses Analog CMOS, BCDMOS, High Voltage CMOS, CMOS Power Amplifier (PA), CMOS Image Sensor (CIS), Display Driver IC (DDI), Touch Screen Controller IC and Embedded Flash technologies. With its best-in-class BCDMOS technology, the company manufactures power management chips that serve numerous applications ranging from home and handheld electronics to automotive and industrial systems. Currently processing technologies at nodes ranging from 0.35 microns to 90 nanometers, the company complements its world class foundry capabilities with top quality design support, prototype verification and packaging/module development. Headquartered in Seoul, Dongbu HiTek publicly trades its stock under 000990 on the Korea Stock Exchange. For more information, visit www.dongbuhitek.com.
