TE Connectivity Shows off DAS and Optical Innovations for Small Cell Networks at Mobile World Congress

Powered Fiber, CPRI Interface Lead Host of New Solutions for Smarter DAS Deployments

Mobile World Congress 2014

MINNEAPOLIS--()--TE Connectivity (TE), a world leader in connectivity, today announced that it will display a range of distributed antenna systems (DAS) and optical infrastructure solutions in booth 6B52 at the Mobile World Congress show in Barcelona this week. These industry-leading solutions make deploying small cell networks easier and more cost-effective. Among the innovations to be showcased in the main booth area are the TE powered fiber cable system that slashes the cost and time of small cell deployments and a CPRI interface to TE’s FlexWave digital DAS products. Among the solutions to be featured inside the booth’s Innovation Center, TE will display an InterReach Fusion DAS with MIMO capabilities, the new active integration panel (AIP) that significantly reduces the space, power and costs of DAS head-end deployment, as well as the latest TE low power Ethernet cable-based DAS solutions.

TE’s DAS and optical infrastructure solutions continually drive down the cost and effort of deploying next-generation wireless networks. For example:

The TE powered fiber cable system combines power and optical communications into one system. It eliminates the complexity of small cell installation, allowing small cell devices to be placed wherever they are needed for maximum 4G wireless coverage. The system incorporates everything needed to power and communicate with a small cell – including the power supply, a hybrid cable, and a remote powering unit that corrects for DC line loss to eliminate the need for electrical design engineering calculations.

The TE pre-integrated CPRI solution eliminates the need for RF processing and attenuation panels on site, which can reduce physical equipment costs by more than 50 percent and cost of materials by 40 percent. The solution achieves additional cost savings by using less power (equipment consumption and cooling), space and fiber, resulting in operational improvements and meeting sustainability demands.

The AIP simplifies the interface between DAS head-end equipment and the carrier base station by eliminating the need for frequency attenuation panels and provides active monitoring of BTS power output. This solution significantly reduces the space, power and cooling required for a DAS head-end.

“These new solutions represent the latest thinking in how to make mobile networks more flexible, cost-effective, and easy to maintain,” said Peter Wraight, vice president and general manager of TE Wireless. “As mobile operators roll out LTE and other advanced services, they rely on TE Connectivity to continue pushing the envelope in terms of lower costs and faster time to revenue.”

In addition to showcasing its latest products, TE will host a hospitality hour in its booth on Monday, February 24, Tuesday, February 25, and Wednesday, February 26 at 16:00 hours. All are welcome to stop by and chat with TE executives in an informal setting.

About TE Connectivity

TE Connectivity (NYSE: TEL) is a $13 billion world leader in connectivity. The company designs and manufactures products at the heart of electronic connections for the world’s leading industries including automotive, energy and industrial, broadband communications, consumer devices, healthcare, and aerospace and defense. TE Connectivity’s long-standing commitment to innovation and engineering excellence helps its customers solve the need for more energy efficiency, always-on communications and ever-increasing productivity. With nearly 90,000 employees in over 50 countries, TE Connectivity makes connections the world relies on to work flawlessly every day. To connect with the company, visit: www.TE.com.

TE Connectivity, TE connectivity (logo), TE (logo), FlexWave, FlexWave Prism and InterReach Fusion are trademarks.

All other logos, products and/ or company names referred to herein might be trademarks of their respective owners.

©2014 TE Connectivity Ltd. company. All rights reserved.

Contacts

TE Connectivity
Media Relations and Product Communications:
Danah Ditzig, 612-210-1023
Senior Marketing Manager
danah.ditzig@te.com

TE will feature the new CPRI DAS solution in booth 6B52 at Mobile World Congress to simplify and reduce costs in multi-carrier mobile networks (Graphic: Business Wire).

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Release Summary

TE Connectivity features small cell and optical innovations in booth 6B52 at Mobile World Congress February 24-27. See TE's new powered fiber cable systems, CPRI DAS, and visit TE's innovation center.

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Contacts

TE Connectivity
Media Relations and Product Communications:
Danah Ditzig, 612-210-1023
Senior Marketing Manager
danah.ditzig@te.com