Rudolph to Participate in the Fifth Annual CEO Investor Summit 2013

Accredited investor and publishing research analyst event to be held concurrently with SEMICON West and Intersolar 2013 in San Francisco

5th Annual CEO Investor Summit 2013

FLANDERS, N.J.--()--Rudolph Technologies, Inc. (NASDAQ: RTEC) today announced that the Company’s management will participate in the Fifth Annual CEO Investor Summit 2013, Wednesday July 10, 2013 in San Francisco, California. Paul McLaughlin, Chairman and CEO will provide an overview of the Company and will discuss its competitive position and future prospects.

About The 5th Annual CEO Summit
The CEO Summit is an accredited investor and publishing research analyst event that is held concurrently with SEMICON® West and Intersolar 2013 in San Francisco. The event is hosted by executive management from participating companies and will feature a “round-robin” format consisting of small group meetings, each 30 minutes in duration.

The CEO Investor Summit is by invitation only and is open to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary.

While held concurrently with SEMICON West and Intersolar 2013, the event is not affiliated with the show.

RSVP Contacts for 5th Annual CEO Summit 2013
To RSVP for the CEO Summit, please contact either of the Summit’s co-chairs.

     
Laura J. Guerrant-Oiye Claire E. McAdams
Guerrant Associates Headgate Partners LLC
Phone: (808) 882-1467 Phone: (530) 265-9899

Email: lguerrant@guerrantir.com

Email: claire@headgatepartners.com

 

About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.

Contacts

Rudolph Technologies, Inc.
Investors:
Laura Guerrant-Oiye, 808-882-1467
lguerrant@guerrantir.com
or
Trade Press:
Amy Pauling, 952-259-1794
amy.pauling@rudolphtech.com

Release Summary

Paul McLaughlin will present at the CEO Investor Summit on July 10 in San Francisco. The 'round-robin' format consists of small group meetings. RSVP early to guarantee attendance.

Contacts

Rudolph Technologies, Inc.
Investors:
Laura Guerrant-Oiye, 808-882-1467
lguerrant@guerrantir.com
or
Trade Press:
Amy Pauling, 952-259-1794
amy.pauling@rudolphtech.com