Research and Markets: STMicroelectronics LPS331AP - Reverse Costing Analysis

DUBLIN--()--Research and Markets (http://www.researchandmarkets.com/research/n2rgtk/stmicroelectronics) has announced the addition of the "STMicroelectronics LPS331AP - Reverse Costing Analysis" report to their offering.

Barometric pressure sensors are equipping more and more portable devices. These components sense the pressure of the atmosphere and help consumer products detect altitude variations indoor or improve the accuracy of altitude measurement in complement of GPS. They can also be used to refine local weather forecasting when used as a barometer.

ST's LPS331AP pressure-sensing device is manufactured using a proprietary MEMS technology, called VENSENS, that allows the pressure sensor to be fabricated on a monolithic silicon chip. This process eliminates wafer-to-wafer bonding. The sensing element in the LPS331AP is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. The sensor and ASIC are packaged in a 3x3x1mm HCLGA.

This report provides a complete teardown of the MEMS gyro with:

- Detailed photos

- Material analysis

- Schematic assembly description

- Manufacturing Process Flow

- In-depth manufacturing cost analysis

- Supply chain evaluation

- Selling price estimation

Key Topics Covered:

Glossary

Overview/Introduction

STMicroelectronics Company Profile

Physical Analysis

Physical Analysis Methodology

- Package

-- Package Characteristics & Markings

-- Package Opening

-- Package Composition

-- Package Cross-Section

ASIC

-- ASIC Dimensions & Markings

-- ASIC Process and metal layers

-- ASIC Cross-Section

-- ASIC Process Characteristics

MEMS

-- Pressure Sensor Markings

-- Pressure Sensor Details

-- Pressure Sensor Dimensions

-- Pressure Sensor Structure

--Pressure Sensor Cross-Section

-- Pressure Sensor process characteristics

Manufacturing Process Flow

- ASIC Process Flow

- Pressure Sensor Process Flow

- Package Process Flow

- Description of the Wafer Fabrication Units

Cost Analysis

- Main Steps of Economic Analysis

- Supply Chain Analysis

- ASIC Wafer Cost

- ASIC Probe & Dicing cost

- ASIC Die Cost

- Pressure Sensor Wafer Cost

- Pressure Sensor Wafer : Equipment Cost per Family

- Pressure Sensor Wafer : Material Cost per Family

- Pressure Sensor Probe & Dicing Cost

- Pressure Sensor Die cost

- LPS331AP Packaging Process Flow

- LPS331AP Packaging Cost Details

- LPS331AP Final Test Cost

- LPS331AP Component Manufacturing Cost

- Yield Synthesis

- LPS331AP Cost Analysis Evolution

Estimated Price Analysis

For more information visit http://www.researchandmarkets.com/research/n2rgtk/stmicroelectronics

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Computing and Technology

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Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Computing and Technology