SAN DIEGO--(BUSINESS WIRE)--Pulse Electronics Corporation (NYSE: PULS), a leading provider of electronic components, announces its new EP13 Plus platform that delivers 25% more power handling capability than the industry standard EP13 platform in the same PCB footprint. This catalog series of 12 isolation transformers is designed for multiple input voltage ranges (9-57v and 33-57v) and can provide six different output voltage combinations from 3.3v to 24v. The transformers are used in DC/DC power supplies for Power over Ethernet (PoE, PoE+), datacom, telecom, and industrial applications.
Pulse’s EP13 Plus platform incorporates two innovative features that advance the wire-wound transformer technology. The first innovation is the use of a modified core with an increased cross-sectional area to reduce the number of turns necessary for a given output voltage, or to increase the output power by better utilization of the available winding window. The second innovation is a new bobbin lead shape which allows for an increased number of lead wire terminations. This helps avoid damaging the leads or causing solder bridges to adjacent leads during IR reflow. Optimization of the magnetic core combined with the modified lead design of the winding termination give the EP13 Plus 25% more power throughput and lower winding resistance.
Pulse Electronics’ EP13 Plus series transformers are designed for either active clamp forward (PA3856.XXXNL) or continuous mode flyback (PA3855.XXXNL) topologies and offer 24 different output voltage and power combinations. The transformers come in an industry standard package of 14.0(h)x17.7(l) mm. The EP13 Plus series is used in a wide variety of electronic applications including wireless base stations, IP phones, security cameras, automation and test equipment, and networking gear.
“The innovative design approach for the new Pulse EP13 Plus platform offers designers the flexibility to create a more efficient design (less power loss) at the same power as the industry platform, or the ability to increase system power density or lower thermal loads in existing designs. In a market where power density and system efficiency are crucial, this is a significant improvement,” said John Gallagher, staff field applications engineer, Pulse Electronics.
Pulse Electronics’ PA3856.XXXNL and PA3855.XXXNL DC/DC isolation transformers meet PoE isolation requirements of functional insulation and 1500Vrms Hipot. The transformers are sold in tray or tape and reel. More information can be found on the datasheet located at http://productfinder.pulseeng.com/productSearch?id=&searchBy=PA3855 and on the Pulse Electronics website at http://www.pulseelectronics.com/index.php?463.
Download the white paper, Optimized Core and Bobbin allow for >25% increase in power handling in DC/DC SMT Transformer for PoE+, Datacom and Industrial Applications, at http://www.pulseelectronics.com/docs/graf/ep13plus_design_notes.pdf.
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About Pulse Electronics:
Pulse Electronics is the electronic components partner that helps customers build the next great product by providing the needed technical solutions. Pulse Electronics has a long operating history of innovation in magnetics, antennas, and connectors, as well as the ability to ramp quickly into high-quality, high-volume production. The Company serves the wireless and wireline communications, power management, military/aerospace, and automotive industries. Pulse Electronics is a participating member of the IEEE, SFF, OIF, HDBaseT Alliance, CommNexus, and MoCA. Visit the Pulse Electronics website at www.pulseelectronics.com.
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Cautionary Note: To the extent that statements in this press release are not strictly historical, such statements are "forward-looking" and made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on the Company's current information and expectations. These forward-looking statements are subject to certain risks and uncertainties that could cause actual results to differ materially from the statements made. Examples of such risks include those related to the risk factors disclosed from time to time in the Company's SEC filings, including, but not limited to, those discussed in the Company's most recent reports on Form 10-K, 10-Q and 8-K, and any amendments thereto. All such risk factors are incorporated herein by reference as though set forth in full. The Company undertakes no obligation to update any forward looking statement.