Newsroom

LONDON--(BUSINESS WIRE)--  FORM 8.3 PUBLIC OPENING POSITION DISCLOSURE/DEALING DISCLOSURE BY A PERSON WITH INTERESTS IN RELEVANT SECURITIES REPRESENTING 1% OR MORE Rule 8.3 of the Takeover Code (the “Code”) 1. KEY INFORMATION (a) Full name of discloser: SAMSON ROCK CAPITAL LLP (b) Owner or controller of interests and short positions disclosed, if different from 1(a): The naming of nominee or vehicle companies is insufficient. For a trust, the trustee(s), settlor and beneficiaries must be named....

LONDON--(BUSINESS WIRE)--  Funds Date TIDM ISIN Code Shares in Issue Currency Net Asset Value NAV/per Share First Trust Vest Nasdaq-100® Moderate Buffer UCITS ETF - March 18.09.2026 QMAR.LN IE0006S0EBF2   50,002.00 USD   1,270,698.59   25.413  ...

LONDON--(BUSINESS WIRE)--  Funds Date TIDM ISIN Code Shares in Issue Currency Net Asset Value NAV/per Share First Trust Indxx Europe Infrastructure UCITS ETF 18.09.2026 FTEI.LN IE000TIZ5AP4  300,002.00 EUR   6,229,954.40   20.766  ...

LONDON--(BUSINESS WIRE)--  Funds Date TIDM ISIN Code Shares in Issue Currency Net Asset Value NAV/per Share First Trust Vest U.S. Equity Max Buffer UCITS ETF- June 18.09.2026 MJUN LN IE000CO3P697  250,002.00 USD   6,392,502.12   25.570  ...

LONDON--(BUSINESS WIRE)--  Funds Date TIDM ISIN Code Shares in Issue Currency Net Asset Value NAV/per Share First Trust Bloomberg Artificial Intelligence UCITS ETF 18.09.2026 FTAI IE000YIQZ0H6  225,002.00 USD   7,124,048.24   31.662  ...

MALAGA, Spain--(BUSINESS WIRE)--Lumentum Holdings Inc. (“Lumentum”) today announced plans for a joint demonstration together with Qualcomm Technologies, Inc. and Corning Incorporated (NYSE: GLW) of a high-density die-to-die (D2D) optical interconnect showcase for AI scale-up architectures at ECOC 2026. The board-level demonstration will combine a D2D interface IP subsystem from Qualcomm Technologies with Lumentum’s VCSEL-based optical interconnect platform and Corning multimode fiber connectivi...

BELGRADE, Serbia--(BUSINESS WIRE)--Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announced the SE200ZC-AP, a new smart module designed to give manufacturers a faster path to AI-enabled cameras, industrial vision systems, and connected devices without the cost and complexity of building custom hardware from scratch. Built around the Rockchip RV1126B/RV1126BJ platform, the SE200ZC-AP features a quad-core ARM Cortex-A53 CPU, a 12-megapixel HDR image signal processor...

BERLIN--(BUSINESS WIRE)--Forschung und Entwicklung, Planung, Testing, Industrialisierung, Produktion und Reparatur in einer Wertschöpfungskette zu bündeln und Bahnelektronik von der Produktdefinition über den gesamten Lebenszyklus hinweg zu begleiten: Dieses Modell präsentiert Elemaster auf der InnoTrans 2026. Die Unternehmensgruppe beschäftigt rund 2000 Mitarbeitende in acht Ländern und ist auf komplexe elektronische und mechatronische Lösungen spezialisiert. Durch die Übernahme von CR&C h...

PARIS--(BUSINESS WIRE)--Havas reports the progress of transactions under its current share buyback program...

MT. LAUREL, N.J.--(BUSINESS WIRE)--2026 Awards of Excellence winners announcement...