Ziptronix Licenses Direct Bond Interconnect (DBI®) and ZiBond® Patented Technologies to Tezzaron Semiconductor for Advanced 3D Memory and 3D Integrated Assemblies

RESEARCH TRIANGLE PARK, N.C.--()--Ziptronix, Inc. has signed a licensing agreement with Tezzaron Semiconductor for the use of patents regarding Ziptronix’s direct bonding technologies, ZiBond™ and DBI®.

“There is a direct and robust synergy between our own 3D technology (FaStack®) and the Ziptronix technologies,” said Bob Patti, CTO of Tezzaron. “DBI, ZiBond, and FaStack make a formidable team. This agreement greatly enhances our ability to produce advanced 3D memories. It also extends our open platform and broadens the scope of 3D and 2.5D devices that we can assemble for customers. With this suite of powerful technologies, we offer a truly ‘one stop’ solution for both 3D and 2.5D.”

Dan Donabedian, CEO of Ziptronix, said: “We believe that Ziptronix’s patented direct bonding technology enables the industry’s best performance for 3D memory. With our DBI®, which contains interconnect at the bond interface, Tezzaron can provide a technologically superior product in the memory market at a lower cost and better performance compared to competitors also attempting 3D integration of advanced memory devices. Tezzaron stands alone today in its adoption of the most advanced interconnection technology and therefore will lead the industry in technology areas only imagined just a few short years ago.”

For more information about Ziptronix’s 3D IC technology and its licensing agreement with Tezzaron, contact Chris Sanders at c.sanders@ziptronix.com, call 919-459-2444 or visit www.ziptronix.com. For more about Tezzaron’s 3D and 2.5D technologies, contact Gretchen Patti at gpatti@tezzaron.com, call 630-505-0404, or visit www.tezzaron.com.

Contacts

Agency Contact:
Sarah-Lyle Dampoux
dampouxs@loomisgroup.fr
Phone: +33 1 58 18 59 30

Release Summary

Ziptronix Licenses Direct Bond Interconnect (DBI®) and ZiBond® Patented Technologies to Tezzaron Semiconductor for Advanced 3D Memory and 3D Integrated Assemblies

Sharing

Contacts

Agency Contact:
Sarah-Lyle Dampoux
dampouxs@loomisgroup.fr
Phone: +33 1 58 18 59 30