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November 30, 2012 08:49 AM Eastern Daylight Time 

Research and Markets: Semiconductor Strain Metrology: Principles and Applications

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/5kjbxp/semiconductor) has announced the addition of the "Semiconductor Strain Metrology: Principles and Applications" book to their offering.

This book surveys the major and newly developed techniques for semiconductor strain metrology. Semiconductor strain metrology has emerged in recent years as a topic of great interest to researchers involved in thin film and nanoscale device characterization. This e-book employs a tutorial approach to explain the principles and applications of each technique specifically tailored for graduate students and postdoctoral researchers. Selected topics include optical, electron beam, ion beam and synchrotron x-ray techniques. Unlike earlier references, this e-book specifically discusses strain metrology with both depth and focus.

Key Topics Covered:

PART 1: INTRODUCTION

1 Introduction to Strain Metrology for Semiconductors

2 Strain, Stress and Semiconductor Properties

PART 2: OPTICAL STRAIN METROLOGY

3 Variable Angle Spectroscopic Ellipsometry

4 Photoreflectance Method

5 Micro-Raman Spectroscopy

PART 3: ELECTRON BEAM STRAIN METROLOGY

6 Cathodoluminescence Method

7 Nano-Beam Diffraction and Convergent Beam Electron Diffraction

8 Dark-Field Electron Holographic Moire Method

PART 4: EMERGING STRAIN METROLOGY

9 Tip-Enhanced Raman Spectroscopy

10 Atomic Force Microscopy Digital Image Correlation Method

11 Synchrotron X-Ray Micro/Nanodiffraction Methods

12 Conclusion and Outlook

For more information visit http://www.researchandmarkets.com/research/5kjbxp/semiconductor

Contacts

Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Semiconductor

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