DUBLIN--(BUSINESS WIRE)--Dublin - Research and Markets (http://www.researchandmarkets.com/research/a1b3df1c/apple_iphone_4s_ca) has announced the addition of the "Apple iPhone 4S Camera Module - Sony 8Mpixel 1.4m BSI CIS Reverse Costing" report to their offering.
- Physical Analysis of the Camera and the CMOS Image Sensor
- Step by Step Reconstruction of the Process Flow
- Cost of Manufacturing and Estimation of Selling Price
System Plus Consulting is proud to publish the reverse costing report of the Apple iPhone 4S Camera Module.
This camera module integrates a 1.4m pixel CMOS Image Sensor (CIS) ref. IMX145 from Sony. The CIS die is manufactured using a CMOS architecture with a 90nm process. The CIS uses a Backside Illumination (BSI) architecture. The CIS is assembled in a ceramic package using flip chip, gold stud ball technique. The module integrates a Voice Coil Motor (VCM) auto-focus.
This report provides complete teardown of the camera module with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
Key Topics Covered:
Glossary
Overview/Introduction
- Executive Summary
- Reverse Costing Methodology
Companies Profiles
- Sony
- Tong Hsing
- LG Innotek
Apple iPhone 4S teardown
Physical Analysis
- Camera Module Views & Dimensions
- Camera Module X-Ray
- Camera Module Disassembly
- CIS Views & Dimensions
- CIS Markings
- CIS Pads
- CIS Microlenses
- CIS Pixels
- CIS Technology node
- Camera Module Cross-section
- CIS Cross-section
- Physical Data Summary
For more information visit http://www.researchandmarkets.com/research/a1b3df1c/apple_iphone_4s_ca