Research and Markets: ST LSM330DLC 6-axis MEMS Inertial Module (3D accelerometer + 3D Gyroscope) - Reverse Costing Analysis

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/0dd468/st_lsm330dlc_6axi) has announced the addition of the "ST LSM330DLC 6-axis MEMS Inertial Module (3D accelerometer + 3D Gyroscope) - Reverse Costing Analysis" report to their offering.

“ST LSM330DLC 6-axis MEMS Inertial Module (3D accelerometer + 3D Gyroscope) - Reverse Costing Analysis”

System Plus Consulting is proud to publish the reverse costing report of the new 6-axis MEMS Inertial Module supplied by STMicroelectronics. The LSM330DLC is a system-in-package featuring a 3axis accelerometer and a 3-axis gyroscope. With a 4.0x5.0x1.1mm size, it belongs to the smallest inertial modules for consumer applications. It is manufactured with the same ST THELMA process used for more than 1.5billon MEMS devices. The LSM330DLC is targeted for consumer applications: GPS navigation systems, Impact recognition and logging, Gaming

This report provides complete teardown of the MEMS IMU with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation

The report provide also a comparative analysis with the previous ST 6DoF MEMS IMU, the LSM330DL.

Key Features at a Glance:

• Physical Analysis of the Devices
• Step by Step Reconstruction of the Process Flow
• Cost of Manufacturing and Estimation of Selling Price

For more information visit http://www.researchandmarkets.com/research/0dd468/st_lsm330dlc_6axi