Business Wire
Welcome
  • Log In
  • Sign Up
Search News:
Help
http://www.invensas.com
February 09, 2012 04:05 PM Eastern Daylight Time 

Invensas xFD Technology Exhibited at Pan Pacific Microelectronics Symposium

Pan Pacific Microelectronics Symposium

SAN JOSE, Calif.--(BUSINESS WIRE)--Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA) will be presenting and exhibiting at the Pan Pacific Microelectronics Symposium, to be held Feb. 14-16, 2012 in Kauai, Hawaii.

WHO:
Vern Solberg

WHAT:
xFDTM: New 3D Packaging Approach for Next Generation High Performance DRAM

WHERE:
Pan Pacific Microelectronics Symposium
Sheraton Poipu Resort
Kauai, Hawaii

WHEN:
Feb. 14, 2012
9:30am – 12:30pm

Safe Harbor Statement

This media alert contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to Invensas’ participation at the Pan Pacific Microelectronics Symposium, as well as the subject matter of Invensas’ presentations at the symposium. Material factors that may cause results to differ from the statements made include changes to the plans or operations relating to Tessera Technologies, Inc.’s (the “Company”) businesses, market or industry conditions; the future expiration of license agreements and the cessation of related royalty income; the failure, inability or refusal of licensees to pay royalties; delays, setbacks or losses relating to the Company’s intellectual property or intellectual property litigations, or any invalidation or limitation of key patents; fluctuations in operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect the Company’s ability to protect or realize the value of its intellectual property; the risk of a decline in demand for semiconductor products; failure by the industry to adopt technologies covered by the Company’s patents; and the future expiration of the Company’s patents. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this media alert. The Company’s filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended Dec. 31, 2010 and Form 10-Q for the period ended Sept. 30, 2011, include more information about factors that could affect the Company’s financial results. The Company assumes no obligation to update information contained in this media alert. Although this media alert may remain available on the Company’s and Invensas’ website or elsewhere, its continued availability does not indicate that the Company is reaffirming or confirming any of the information contained herein.

About Invensas Corporation

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), acquires, develops, and monetizes strategic intellectual property (IP) in areas such as circuitry design, memory modules, 3-D systems, and advanced interconnect technologies, to serve the dynamic mobile, storage and consumer electronics sectors. The group is headquartered in San Jose, California. For information call 1.408.321.6000 or go to www.invensas.com.

Invensas and the Invensas logo are trademarks of Invensas Corporation or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

Contacts

Tessera Technologies
Moriah Shilton, 408-321-6713
Sr. Director, Investor Relations

Recent Stories from Invensas Corporation

  • View Press Release
    Invensas Unveils Groundbreaking Package-on-Package Solution for Next-Generation Smartphone and Tablet Computing
    May 22, 2012
    SAN JOSE, Calif.--(BUSINESS WIRE)--Invensas' bond via array (BVA) technology is an ultra-high I/O package-on-package (PoP) solution ideally suited for smartphones and tablet computing. more »
  • View Press Release
    Tessera Technologies Announces First Quarter 2012 Results
    April 26, 2012
    SAN JOSE, Calif.--(BUSINESS WIRE)--Tessera Technologies, Inc. (NASDAQ: TSRA) (the “Company” or “we”) announced its results for the first quarter ended March 31, 2012. “The first quarter of 2012 was... more »
  • View Press Release
    DigitalOptics Corporation Licenses Market Leading Image Enhancement Technology to Cammsys
    April 24, 2012
    SAN JOSE, Calif.--(BUSINESS WIRE)--DigitalOptics Corporation™, a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ: TSRA), announced that it has licensed its Face Tracker™ facial tracki... more »
More Stories
RSS feed for Invensas Corporation
http://www.invensas.com

Release Versions

  • EON: Enhanced Online News

Company Information Center

Invensas Corporation RSS feed for Invensas Corporation

NASDAQ:TSRA

Share

  • Facebook
  • Twitter
  • LinkedIn
  • Delicious
  • Reddit
  • StumbleUpon
  • Digg
  • MySpace
  • Newsvine
  • Google Bookmark
  • Yahoo! Bookmark
  • EmailEmail
Tweet
  • EmailEmail
All News
Business Wire
  • Home
    • Home
    • Membership Benefits
    • Submit a Press Release
  • News
    • All News
    • News with Multimedia
    • News by Industry
    • News by Subject
    • News by Language
    • RSS Feeds
    • Business Wire Mobile
    • Features
    • Company NewsCenters
    • Company Profiles
    • Annual Reports
  • Events
    • Trade Shows & Events
    • Earnings & Conference Calls
    • Business Wire Events
  • PR Services
    • Press Release Distribution
    • Distribution Lists
    • Industry Targeting
    • LatinoWire & Ethnic Media
    • Public Policy Wire
    • Trade Show Services
    • Photos & Multimedia Marketing
    • GloMoSoMe
    • Press Release Measurement
    • Mobile Alerts
    • Clips & Research
    • Fax & Email Services
    • Online Newsrooms
    • News Feeds
  • IR Services
    • Material News Disclosure
    • XBRL
    • EDGAR (US)
    • IPO Services
    • SEDAR (Canada)
    • European Disclosure
    • Corporate Social Responsibility (CSR)
    • Investor Targeting
    • Fax & Email Services
    • Online Investor Centers
    • IR Resource Center
  • SEO Services
    • Press Release Optimization
    • EON: Enhanced Online News
    • Webinars & Resources
  • Journalist Tools
    • PressPass: Your News
    • Conduct Surveys
    • Business Wire News Feeds
    • Business Wire News On Your Website
    • Journalism Associations
  • Support & Education
    • FAQ
    • How to Write a Press Release
    • How To Optimize a Press Release for Search
    • How to Distribute a Press Release
    • Find Your News Online
    • Sample Press Release
    • Features News Tips
    • International Media Tips
    • SEC Regulations
    • Exchange Guidelines
    • White Papers
    • Webinars & Podcasts
    • Get WiredIn!
  • About Us
    • Business Wire Newsroom
    • Contact Us
    • History
    • Jobs
  • About Us
  • Contact Us
  • Site Map
  • Privacy Statement
  • Terms of Use
  • ©2012 Business Wire

More Business Wire sites

  • Canada
  • UK/Ireland
  • Deutschland
  • France
  • Italy
  • Japan
  • EON: Enhanced Online News
  • Tradeshownews.com
  • PYMNTS.com

About Us

  • Business Wire Newsroom
  • Contact Us
  • Business Wired blog

News on BusinessWire.com

  • All News
  • RSS Feeds
  • Business Wire Mobile Apps

Follow Us on Twitter

  • @BusinessWire
  • @BWSportsWire
  • @BWPolitics
  • @BWCSRNews
  • @EONpr
  • @TradeshowNews
  • @BW_Canada
  • @BWIntlMedia
  • @BWInfoDiva
  • @BusinessWireFR
  • @BWLatinoWire

Like Us on Facebook

  • Business Wire
  • Tradeshow News