Enpirion Announces Manufacturing Partnership Agreement for Silicon Magnetics with China’s Leading IC Assembly and Packaging Manufacturer

Leap in MEMS Magnetics Technology will Commercialize the World’s First Monolithic DC-DC Converter System-on-Chip

HAMPTON, N.J.--(BUSINESS WIRE)--Enpirion, Inc. is announcing today that it has entered into a strategic partnership agreement with JiangyinChangdian Advanced Packaging Co., Ltd. -- JCAP -- for the manufacturing of silicon-based magnetics utilizing Enpirion’s proprietary MEMS (Micro-electronic Magnetic Silicon) technology.  Earlier in 2011, Enpirion demonstrated that its MEMS technology achieved all necessary application performance figures-of-merit at record frequencies of 18 MHz in its DC-DC power system-on-chip (PowerSoC). This announcement marks another key milestone in Enpirion’s leadership and commercialization efforts using low-cost silicon-based magnetics partnering with JCAP with its specialized, high volume wafer level packaging manufacturing capabilities. JCAP is implementing and fully qualifying Enpirion’s innovative magnetic material processes.

“Since the company’s inception, we have invested heavily in developing silicon-based magnetic technologies that complement our high frequency CMOS power technology. This will permit Enpirion to continue to extend its leadership in integrated DC-DC power solutions by penetrating into new applications such as cost-effective LDO replacements.”

“I am happy to announce our collaboration with JCAP on the integration of Enpirion’s advanced MEMS technology into JCAP’s innovative wafer level manufacturing operations,” said Denis Regimbal, CEO of Enpirion. “Since the company’s inception, we have invested heavily in developing silicon-based magnetic technologies that complement our high frequency CMOS power technology. This will permit Enpirion to continue to extend its leadership in integrated DC-DC power solutions by penetrating into new applications such as cost-effective LDO replacements.”

Lai Chih-Ming, President of JCAP said: “We are excited to have been selected by Enpirion, the leader in integrated power management, to bring to market this advanced technology for magnetic materials on silicon wafers for the first time in power applications using our world renowned, innovative, high volume wafer level bump and chip scale manufacturing processes. Clearly this next generation technology will deliver the first low cost, fully integrated DC-DC converter on silicon. We look forward to growing this business with Enpirion.”

About Enpirion

Enpirion, the leading provider of integrated power management solutions, simplifies design complexity while addressing the space constraint and efficiency needs faced by designers of enterprise, telecom,storage, industrial and embedded applications. By engineering complete power systems that leverage its intellectual property in high-frequency power conversion, magnetics and packaging, Enpirion has developed an extensive family of DC-DC converters with integrated inductors. These power system-on-chip (PowerSoC) solutions enable the industry’s smallest solution footprint and are recognized for their high efficiency, low noise, exceptional thermal performance, high reliability and ease of use. Unlike discrete power products, Enpirion’s turnkey solut ions give designers complete power systems that are fully simulated, characterized, validated and production qualified. For more information about Enpirion, please visit www.enpirion.com.

About JCAP

JiangyinChangdian Advanced Packaging Co., Ltd. (JCAP) is a subsidiary of Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) a leading manufacturer of discrete semiconductor devices, the largest indigenous packaging subcontractor for discrete and IC packaging assembly and test in mainland China. Besides its major business in bump technology (Solder bump, Gold bump, Pillar bump) mass production, JCAP is also focused on leading Wafer Level Chip Scale Packaging ---- WLCSP, which is widely used in mobile phones, notebooks, computers, cameras, MP3 players, watches, etc., and is applied to audio amplifiers, analog switches, EMA, EMI, drivers, DC-DC, etc. As a unique WLCSP company in mainland China, JCAP supports turnkey services including bumping, probing and assembly. Not only is JCAP certified for ISO 9001:2000, ISO 14001:2004, ISO/TS 16949:2002, QC80000:2005 and Sony Green Partner Program:2009, but it also been qualified by many top-name companies all around the world. For more information about JCAP, please visit www.jcap.cn.