OIF Approves Micro Tunable Laser for Smaller Footprint

FREMONT, Calif.--(BUSINESS WIRE)--The Optical Internetworking Forum (OIF) members approved the Micro Integrable Tunable Laser Assembly (uITLA) implementation agreement (IA) which addresses the form factor for 100G applications with reduced power dissipation and space requirements. OIF members also approved two additional documents under the 100G framework umbrella this month.

“This event facilitated discussion of the challenges Tellabs looks to solve through the work of the OIF.”

“The OIF is continually refining our technology driven documents to fit the rapidly evolving market,” said Karl Gass of TriQuint Semiconductor and the OIF’s Physical and Link Layer Working Group vice-chair. “The OIF has completed several tunable laser projects that are commercially successful and will continue to update our 100G centric documents to support the needs of vendors and carriers and the emerging market.”

The uITLA is a smaller form-factor that provides a 60% reduction in area and a nearly 30% reduction in height. In addition, the power consumption was reduced by 25%. OIF members have been working to prevent market fragmentation in component mechanical form factors for new high-density modules or line card applications.

Additional IAs from the OIF

The following IAs are maintenance updates to 100G technology areas that came about as vendors began building product. OIF working group members found there were clarifications needed to maintain commonality among these components.

The 100G Long Haul DWDM Transmission Module Multi-Source Agreement (MSA) is a follow-on to the successful 300-pin transponder used in 10G and 40G applications. The OIF worked with the CFP MSA to align the two MSAs to incorporate a common management interface that addresses module communication and commands, including interfacing to the laser and adjusting for changes in power. In addition, clarifications were made to several mechanical specifications.

The Integrated Intradyne Coherent Receiver IA provides definition for a highly integrated photonic component enabling reductions in the cost and size of 100G transceivers. This update clarified several operating and mechanical characteristics and resulted in a body length reduction of 80% from 60 mm to 50 mm.

All completed IAs can be viewed at the OIF website, http://www.oiforum.com

OIF Day at Tellabs

The OIF recently held “OIF Day at Tellabs” as part of the continuing series of interactive and educational workshops that feature OIF and member company subject matter experts. OIF and Tellabs speakers presented on various topics including OIF projects and directions, electrical interfaces, transparent optical networking and beyond. Through these exclusive, member-only events, the OIF is directly reaching out to understand equipment vendor challenges and strategies unlike any other industry forum.

“Tellabs values the OIF’s unique role bringing together carriers, equipment vendors and component suppliers to develop industry solutions,” said Dan Kelly, Executive VP, Global Products for Tellabs. “This event facilitated discussion of the challenges Tellabs looks to solve through the work of the OIF.”

About the OIF

Launched in 1998, the OIF is the first industry group to unite representatives from data and optical networking disciplines, including many of the world's leading carriers, component manufacturers and system vendors. The OIF promotes the development and deployment of interoperable networking solutions and services through the creation of Implementation Agreements (IAs) for optical, interconnect, network processing, component and networking systems technologies. The OIF actively supports and extends the work of standards bodies and industry forums with the goal of promoting worldwide compatibility of optical internetworking products. Information on the OIF can be found at http://www.oiforum.com.