Invensas Unveils Multi-Die Face-Down Packaging Technology at IDF

IDF 2011 San Francisco

SAN JOSE, Calif.--()--Invensas Corporation, a wholly-owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), announced that it will demonstrate the dual-face down (DFD) implementation of its new multi-die face-down (xFD) packaging technology at the Intel Developer's Forum (IDF) in San Francisco September 13-15, 2011.

As a result of rapid growth in multi-core processing and computing virtualization, today’s data center servers require increased DRAM capacity and performance. New applications for notebook computers, tablets and smart phones also demand additional device performance balanced with battery life and reduced form-factor. A market-ready packaging platform, the Invensas™ xFD™ technology is cost-effective and improves capacity and performance for DRAM devices and memory modules.

xFD is a novel multi-die, wirebond-based packaging technology that mounts integrated circuits (ICs) upside down and staggers them in a shingle-like configuration, incorporating short wirebonds in a structure similar to that of a window-BGA package. With this approach, xFD:

  • improves capacity and decreases overall component size with a 25 to 35 percent savings in vertical height over conventional solutions
  • enhances electrical performance with a 50 to 70 percent improvement in speed-bin yield due to symmetric top and bottom die performance
  • provides a 20 to 30 percent heat transfer advantage over conventional dual-die packages (DDPs)

Invensas xFD technology costs less to manufacture than conventional multi-die DRAM packages because it employs a parallel process flow; significantly reduces gold and other material usage; and is manufactured on existing wirebond assembly lines.

“We developed the xFD technology platform in response to continued industry demand for denser, faster and cheaper DRAM solutions for servers and mobile devices,” said Simon McElrea, president of Invensas Corporation. “xFD provides single-die package performance in a multi-die configuration as well as delivering significant thickness and thermal advantages. Unlike more complex alternatives, xFD is manufactured using existing industry manufacturing capacity, significantly reducing the cost, time and risk of high-volume adoption.”

Invensas will demonstrate its DFD technology in its booth at IDF.

WHAT:

    Intel Developers Conference
 

WHERE:

Moscone Center
West Hall

Booth #414

San Francisco California
 

WHEN:

September 13-15, 2011
 

Safe Harbor Statement

This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to the features, characteristics and benefits of Invensas’ xFD technology and Invensas’ participation at the Intel Developer’s Forum, as well as the subject matter of the Invensas’ presentations at the forum. Material factors that may cause results to differ from the statements made include delays, setbacks or losses relating to Tessera Technologies, Inc.’s (the “Company” or “Tessera”) intellectual property or intellectual property litigations, or any invalidation or limitation of the Company’s key patents; fluctuations in the Company’s operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect the Company’s ability to protect its intellectual property; the risk of a decline in demand for semiconductor products; failure by the industry to adopt the Company’s technologies; competing technologies; the future expiration of the Company’s patents; the future expiration of the Company’s license agreements and the cessation of related royalty income; the failure or refusal of licensees to pay royalties; failure to achieve the growth prospects and synergies expected from acquisition transactions; and delays and challenges associated with integrating acquired companies with the Company’s existing businesses. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. Tessera’s filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended December 31, 2010 and its Quarterly Report on Form 10-Q for the quarter ended June 30, 2011, include more information about factors that could affect the Company's financial results. Tessera assumes no obligation to update information contained in this press release. Although this release may remain available on Tessera's and Invensas’ website or elsewhere, its continued availability does not indicate that Tessera is reaffirming or confirming any of the information contained herein.

About Invensas Corporation

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), acquires, develops and monetizes strategic intellectual property (IP) in areas such as, circuitry design, 3-D systems, memory modules and other enabling technologies, to serve the dynamic mobile, storage and consumer electronics sectors. Invensas’ IP portfolio includes approximately 280 patents and patent applications. The group is headquartered in San Jose, California. For information call 1.408.321.6000 or go to www.invensas.com.

Invensas and the Invensas logo are trademarks of Invensas Corporation or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

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Contacts

Invensas Corporation
Judy Erkanat, +1-408-321-6751
pr@invensas.com

Invensas Dual Face Down Implementation of Multi-Die Technology (Photo: Business Wire)

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Contacts

Invensas Corporation
Judy Erkanat, +1-408-321-6751
pr@invensas.com