DUBLIN--(BUSINESS WIRE)--The "Automotive Power Module Packaging Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)" report has been added to ResearchAndMarkets.com's offering.
The automotive power module packaging market is expected to grow with a CAGR of 7.5%, over the forecast period (2021 - 2026).
Companies Mentioned
- Amkor Technology
- Kulicke and Soffa Industries Inc.
- PTI Technology Inc.
- Infineon Technologies
- STMicroelectronics
- Fuji Electric Co. Ltd.
- Toshiba Electronic Device & Storage Corporation
- Semikron
- STATS ChipPAC Ltd. (JCET)
- Starpower Semiconductor Ltd.
Key Market Trends
Electric Vehicle and Hybrid Electric Vehicle to Drive the Automotive Power Module Packaging
- Over the past decade, electric vehicle technologies have gained significant progress due to the added advancement in electric motor drives, power converters, on-board batteries and systems integration.
- Advanced electric drive vehicles such as hybrid-electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), range-extended electric vehicle (REEV) and pure electric vehicles (EVs) employed advanced power electronics devices to control the flow of electrical energy from the on-board battery to the traction motors and other accessories.
- In advanced power electronics systems, apart from control topology and components, packaging plays an important role to improve the overall efficiency and reliability.
- Initially, the automotive power module packaging followed the standard of industrial drive module packaging, using the well-established wire bond technology. Such a basic packaging structure has gone through significant improvements in the pursuit of better electrical and thermal performance, reliability and cost-effectiveness.
- Need for improving the present practice of packaging in power electronics modules is amplified due to the stringent requirements of electric vehicles. The pursuit for higher current density is expected to be continued, and it brings along with it a need for continued improvement of cooling. Advancement in power electronic packaging is essential to support these needs.
- As the demand for Electric Vehicle will increase, the requirement of power module packaging will also increase to support the high power density and mechatronics integration.
Asia-Pacific is Expected to Register Highest Growth Rate
- The Asia-Pacific region is estimated to hold the largest market share during the forecast period owing to growing automotive infrastructure and increases in sales of electric vehicles across the region.
- Increasing uses of electrification in vehicles is expected to boost the demand for automotive power module packaging market in this region.
- Furthermore, increasing investment by public and private players to develop automotive power modules such as power inverter, integrated dual charger, among others and the rise in demand for safety features in vehicles across the region are contributing in the growth of this market in this region.
- Moreover, the governments of countries, like China and India, where the pollution is rampant, are taking actions to reduce the pollution issue, thereby resulting in the rise in sales of the alternative fuel engines and green vehicles, such as the electric vehicle, hybrid electric vehicle, among others.
Key Topics Covered:
1 INTRODUCTION
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Electric Vehicle and Hybrid Electric Vehicle to Drive the Automotive Power Module Packaging
4.3.2 Growing Demand Energy Efficient Battery Powered Devices.
4.3.3 Increasing Stringency of Emission Standards
4.4 Market Restraints
4.4.1 Lack of Standard Protocols for the Development of Power Modules
4.4.2 Slow Adoption of New Technologies Derailing Innovation
4.5 Industry Value Chain Analysis
4.6 Industry Attractiveness - Porter's Five Force Analysis
4.7 Technology Snapshot
5 MARKET SEGMENTATION
5.1 By Type
5.1.1 Intelligent Power Module (IPM)
5.1.2 SiC Module
5.1.3 GaN Module
5.1.4 Others (IGBT,FET)
5.2 Geography
5.2.1 North America
5.2.2 Europe
5.2.3 Asia-Pacific
5.2.4 Rest of the World
6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 Amkor Technology
6.1.2 Kulicke and Soffa Industries Inc.
6.1.3 PTI Technology Inc.
6.1.4 Infineon Technologies
6.1.5 STMicroelectronics
6.1.6 Fuji Electric Co. Ltd.
6.1.7 Toshiba Electronic Device & Storage Corporation
6.1.8 Semikron
6.1.9 STATS ChipPAC Ltd. (JCET)
6.1.10 Starpower Semiconductor Ltd.
7 INVESTMENT ANALYSIS
8 MARKET OPPORTUNITIES AND FUTURE TRENDS
For more information about this report visit https://www.researchandmarkets.com/r/jpm7t5
