LONDON--(BUSINESS WIRE)--The 3D sensor market is expected to grow by USD 14.7 bn, decelerating at a CAGR of over 29% during the forecast period. Download Free Sample Report
The use of 3D sensors in security systems is one of the major factors propelling market growth.
More details: https://www.technavio.com/report/3d-sensors-market-industry-analysis
3D Sensors Market: Application Landscape
Based on the application, the consumer electronics segment is expected to witness lucrative growth during the forecast period.
3D Sensors Market: Geographic Landscape
By geography, North America is going to have a lucrative growth during the forecast period. About 30% of the market’s overall growth is expected to originate from North America. The US, Canada, and Mexico are the key markets for 3D sensors in North America.
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Companies Covered:
- ams AG
- Broadcom Inc.
- Himax Technologies Inc.
- ifm electronic Gmbh
- Infineon Technologies AG
- Intel Corp.
- OmniVision Technologies Inc.
- Sony Corp.
- STMicroelectronics NV
- Texas Instruments Inc.
What our reports offer:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers market data for 2019, 2020, until 2024
- Market trends (drivers, opportunities, threats, challenges, investment opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Technavio suggests three forecast scenarios (optimistic, probable, and pessimistic) considering the impact of COVID-19. Technavio’s in-depth research has direct and indirect COVID-19 impacted market research reports.
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Key Topics Covered:
PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
- 2.1 Preface
- 2.2 Preface
- 2.3 Currency conversion rates for US$
PART 03: MARKET LANDSCAPE
- Market ecosystem
- Market characteristics
- Value chain analysis
- Market segmentation analysis
PART 04: MARKET SIZING
- Market definition
- Market sizing 2019
- Market Outlook
- Market size and forecast 2019-2024
PART 05: FIVE FORCES ANALYSIS
- Bargaining power of buyers
- Bargaining power of suppliers
- Threat of new entrants
- Threat of substitutes
- Threat of rivalry
- Market condition
PART 06: MARKET SEGMENTATION BY APPLICATION
- Market segmentation by application
- Comparison by application
- Consumer electronics - Market size and forecast 2019-2024
- Industrial/commercial - Market size and forecast 2019-2024
- Automotive - Market size and forecast 2019-2024
- Healthcare - Market size and forecast 2019-2024
- Others - Market size and forecast 2019-2024
- Market opportunity by application
PART 07: CUSTOMER LANDSCAPE
PART 08: GEOGRAPHIC LANDSCAPE
- Geographic segmentation
- Geographic comparison
- North America - Market size and forecast 2019-2024
- APAC - Market size and forecast 2019-2024
- Europe - Market size and forecast 2019-2024
- South America - Market size and forecast 2019-2024
- MEA - Market size and forecast 2019-2024
- Key leading countries
- Market opportunity
PART 09: DECISION FRAMEWORK
PART 10: DRIVERS AND CHALLENGES
- Market drivers
- Market challenges
PART 11: MARKET TRENDS
- Growing number of strategic partnerships among market participants
- Integration of multiple-lens camera systems in smartphones
- Growing investments in autonomous vehicles
PART 12: VENDOR LANDSCAPE
- Overview
- Landscape disruption
- Competitive scenario
PART 13: VENDOR ANALYSIS
- Vendors covered
- Vendor classification
- Market positioning of vendors
- ams AG
- Broadcom Inc.
- Himax Technologies Inc.
- ifm electronic Gmbh
- Infineon Technologies AG
- Intel Corp.
- OmniVision Technologies Inc.
- Sony Corp.
- STMicroelectronics NV
- Texas Instruments Inc.
PART 14: APPENDIX
- Research methodology
- List of abbreviations
- Definition of market positioning of vendors
PART 15: EXPLORE TECHNAVIO
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