Wafer Dicing Saws Market 2020-2024: Forecasting Strategy to Undergo a Paradigm Shift From Crisis to New Normal During COVID-19 Pandemic | Technavio

LONDON--()--The wafer dicing saws market will witness an incremental growth of USD 95.94 million during 2020-2024, according to the latest pandemic recovery-based research report by Technavio. Factors such as imposition of worldwide lockdowns have partially halted operations and affected supply chains and logistics. This has further impacted economies around the globe, resulting in an overall slowdown during 2020. However, businesses are gradually carving out unique pathways to recover from the COVID-19 crisis. With the exemption of lockdowns, growing incorporation of active social distancing and remote working, and surging entries of players in digital marketplaces, various industry and market conditions are likely to improve by early 2021.

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COVID-19 Highlights

  • Information Technology industry will have Mixed impact due to the pandemic
  • Wafer dicing saws market is expected to witness Negative growth during 2020-2024
  • Information Technology Industry will witness Direct impact during the forecast period
  • Wafer dicing saws market growth is likely to Increase in 2020 compared to 2019 due to Positive YOY

Markets across the globe have faced the economic wrath of the pandemic and are dealing with uncertainties by banking on the online marketspace to reach out to a wider target audience. This wafer dicing saws market research report encompasses all possible factors expected to drive the market growth and create opportunities for all the stakeholders in the supply chain. View detailed wafer dicing saws market insights here: https://www.technavio.com/report/wafer dicing saws market-industry-analysis

Key Wafer Dicing Saws Market Research Findings

  • A CAGR of almost 3% is expected to be recorded in wafer dicing saws market during 2020-2024
  • Pureplay foundries will hold the largest market share. One of the major reasons for the dominance of pureplay semiconductor foundries is their ability to produce dies on a large scale, which reduces the overall cost of production.
  • APAC will account for the highest incremental growth. The increasing number of semiconductor devices that are required for data centers, Internet of Things (IoT), and self-driving cars will significantly drive wafer dicing saws market growth in this region over the forecast period.
  • Growing demand for IoT will boost the wafer dicing saws market growth
  • Increase in the growth of smart cities will have a positive impact on the wafer dicing saws market
  • Volatile nature of the semiconductor industry is likely to create hindrance for the wafer dicing saws market

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Wafer Dicing Saws Market Vendor Participation Scenario

  • Market is Concentrated
  • Several leading companies in the market are focusing on restoring their economic activity
  • Vendors are concentrating on growth prospects from fast-growing segments while retaining their positions in slow-growing segments.
  • Prominent Wafer Dicing Saws market players are: Advanced Dicing Technologies, DISCO Corp., Dynatex International, Loadpoint Ltd., and Tokyo Seimitsu Co. Ltd.

With more companies navigating the pandemic gradually, this research analysis can be personalized to create a recovery path for the market participants. Try out our $1000 Worth Free Report Customization by Speaking to our Analyst or Industry Expert

Key Considerations for Market Forecast

  • Products and services used to manage or contain the spread of COVID-19 virus
  • Products and services used for the treatment of COVID-19 virus
  • Impact of lockdowns, supply chain disruptions, demand destruction, and change in customer behavior
  • Optimistic, base case, and pessimistic scenarios for all markets as the impact of pandemic unfolds
  • Pre- and post-COVID 19 market estimates
  • Quarterly impact analysis as the spread reaches global level and updates on market estimates

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Table of Contents:

Executive Summary

Market Landscape

  • Market ecosystem
  • Market characteristics
  • Value chain analysis

Market Sizing

  • Market definition
  • Market segment analysis
  • Market size 2019
  • Market outlook: Forecast for 2019 - 2024

Five Forces Analysis

  • Five force summary
  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

Market Segmentation by End-user

  • Market segments
  • Comparison by End user
  • Pureplay foundries - Market size and forecast 2019-2024
  • IDMs - Market size and forecast 2019-2024
  • Market opportunity by End user

Market Segmentation by Packaging

  • Market segments
  • Comparison by Packaging
  • BGA - Market size and forecast 2019-2024
  • QFN - Market size and forecast 2019-2024
  • Market opportunity by Packaging

Customer landscape

Geographic Landscape

  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2019-2024
  • North America - Market size and forecast 2019-2024
  • Europe - Market size and forecast 2019-2024
  • South America - Market size and forecast 2019-2024
  • MEA - Market size and forecast 2019-2024
  • Key leading countries
  • Market opportunity by geography
  • Market drivers
  • Market challenges
  • Market trends

Vendor Landscape

  • Overview
  • Vendor landscape
  • Landscape disruption
  • Industry risks

Vendor Analysis

  • Vendors covered
  • Market positioning of vendors
  • Advanced Dicing Technologies
  • DISCO Corp.
  • Dynatex International
  • Loadpoint Ltd.
  • Tokyo Seimitsu Co. Ltd.

Appendix

  • Scope of the report
  • Currency conversion rates for US$
  • Research methodology
  • List of abbreviations

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Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions. With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

Release Summary

The Global Wafer Dicing Saws Market will grow by USD 95.94 mn during 2020-2024

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/