$44.2 Billion Worldwide Semiconductor Advanced Packaging Industry to 2027 - Impact of COVID-19 on the Market - ResearchAndMarkets.com

DUBLIN--()--The "Semiconductor Advanced Packaging - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.

The publisher brings years of research experience to the 9th edition of this report. The 184-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.

Global Semiconductor Advanced Packaging Market to Reach $44.2 Billion by 2027

Amid the COVID-19 crisis, the global market for Semiconductor Advanced Packaging estimated at US$32 Billion in the year 2020, is projected to reach a revised size of US$44.2 Billion by 2027, growing at a CAGR of 4.7% over the analysis period 2020-2027.

Flip Chip Packaging, one of the segments analyzed in the report, is projected to record a 4.5% CAGR and reach US$34.4 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the FI WLP segment is readjusted to a revised 5.9% CAGR for the next 7-year period.

The U.S. Market is Estimated at $9.4 Billion, While China is Forecast to Grow at 4.5% CAGR

The Semiconductor Advanced Packaging market in the U.S. is estimated at US$9.4 Billion in the year 2020. China, the world's second largest economy, is forecast to reach a projected market size of US$7.8 Billion by the year 2027 trailing a CAGR of 4.5% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.4% and 4% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4.5% CAGR.

2.5D/3D Packaging Segment to Record 6.3% CAGR

In the global 2.5D/3D Packaging segment, USA, Canada, Japan, China and Europe will drive the 6.5% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.7 Billion in the year 2020 will reach a projected size of US$2.7 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$4.9 Billion by the year 2027.

Competitors identified in this market include, among others:

  • Amkor Technology, Inc.
  • ASE Technology Holding, Co., Ltd.
  • China Wafer Level CSP Co., Ltd.
  • ChipMOS Technologies, Inc.
  • FlipChip International LLC
  • HANA Micron Inc.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • King Yuan Electronics Corp. (KYEC)
  • Nepes Corporation
  • Powertech Technology, Inc.
  • Samsung Semiconductor, Inc.
  • SIGNETICS
  • Tianshui Huatian Technology Co., Ltd.
  • TongFu Microelectronics Co., Ltd.
  • TSMC Ltd.
  • UTAC Holdings Ltd.
  • Veeco Instruments Inc.

Key Topics Covered:

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

  • Global Competitor Market Shares
  • Semiconductor Advanced Packaging Competitor Market Share Scenario Worldwide (in %): 2019 & 2025
  • Impact of COVID-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

III. MARKET ANALYSIS

IV. COMPETITION

Total Companies Profiled: 46

For more information about this report visit https://www.researchandmarkets.com/r/sit3tf

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Contacts

ResearchAndMarkets.com
Laura Wood, Senior Press Manager
press@researchandmarkets.com

For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900