Semiconductor Advanced Packaging Market Analysis Highlights the Impact of COVID-19 2020-2024 | Growing Demand for Compact Electronic Devices to Boost the Market Growth | Technavio

Technavio has announced its latest market research report titled Global Semiconductor Advanced Packaging Market 2020-2024 (Graphic: Business Wire)

LONDON--()--Technavio has been monitoring the semiconductor advanced packaging market and it is poised to grow by USD 14.41 billion during 2020-2024, progressing at a CAGR of over 8% during the forecast period. The report offers an up-to-date analysis regarding the current market scenario, latest trends and drivers, and the overall market environment.

Although the COVID-19 pandemic continues to transform the growth of various industries, the immediate impact of the outbreak is varied. While a few industries will register a drop in demand, numerous others will continue to remain unscathed and show promising growth opportunities. Technavio’s in-depth research has all your needs covered as our research reports include all foreseeable market scenarios, including pre- & post-COVID-19 analysis. Download a Free Sample Report on COVID-19 Impacts

The market is fragmented, and the degree of fragmentation will accelerate during the forecast period. Amkor Technology Inc., ASE Technology Holding Co. Ltd., ChipMOS TECHNOLOGIES Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., King Yuan Electronic Co. Ltd., Koch Industries Inc., Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Co. Ltd., UTAC Holdings Ltd., and Veeco Instruments Inc. are some of the major market participants. To make the most of the opportunities, market vendors should focus more on the growth prospects in the fast-growing segments, while maintaining their positions in the slow-growing segments.

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Growing demand for compact electronic devices has been instrumental in driving the growth of the market.

Technavio's custom research reports offer detailed insights on the impact of COVID-19 at an industry level, a regional level, and subsequent supply chain operations. This customized report will also help clients keep up with new product launches in direct & indirect COVID-19 related markets, upcoming vaccines and pipeline analysis, and significant developments in vendor operations and government regulations.

Semiconductor Advanced Packaging Market 2020-2024: Segmentation

Semiconductor Advanced Packaging Market is segmented as below:

  • Packaging Technology
    • Flip Chip Packaging
    • FI WLP
    • 2.5D/3D Packaging
    • FO WLP
  • Geography
    • APAC
    • North America
    • Europe
    • South America
    • MEA
  • Device Type
    • Analog And Mixed ICs
    • MEMS And Sensors
    • Logic and Memory Devices
    • Wireless Connectivity Devices
    • CMOS Image Sensors

To learn more about the global trends impacting the future of market research, download a free sample: https://www.technavio.com/talk-to-us?report=IRTNTR43230

Semiconductor Advanced Packaging Market 2020-2024: Scope

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources. The semiconductor advanced packaging market report covers the following areas:

  • Semiconductor Advanced Packaging Market Size
  • Semiconductor Advanced Packaging Market Trends
  • Semiconductor Advanced Packaging Market Analysis

This study identifies the integration of semiconductor components in vehicles as one of the prime reasons driving the semiconductor advanced packaging market growth during the next few years.

Technavio suggests three forecast scenarios (optimistic, probable, and pessimistic) considering the impact of COVID-19. Technavio’s in-depth research has direct and indirect COVID-19 impacted market research reports.

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Semiconductor Advanced Packaging Market 2020-2024: Key Highlights

  • CAGR of the market during the forecast period 2020-2024
  • Detailed information on factors that will assist semiconductor advanced packaging market growth during the next five years
  • Estimation of the semiconductor advanced packaging market size and its contribution to the parent market
  • Predictions on upcoming trends and changes in consumer behavior
  • The growth of the semiconductor advanced packaging market
  • Analysis of the market’s competitive landscape and detailed information on vendors
  • Comprehensive details of factors that will challenge the growth of semiconductor advanced packaging market vendors

Table of Contents:

Executive Summary

Market Landscape

  • Market ecosystem
  • Value chain analysis

Market Sizing

  • Market definition
  • Market segment analysis
  • Market size 2019
  • Market outlook: Forecast for 2019 - 2024

Five Forces Analysis

  • Five forces summary
  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

Market Segmentation by Device type

  • Market segments
  • Comparison by device type
  • Analog and mixed ICs - Market size and forecast 2019-2024
  • MEMS and sensors - Market size and forecast 2019-2024
  • Logic and memory devices - Market size and forecast 2019-2024
  • Wireless connectivity devices - Market size and forecast 2019-2024
  • CMOS image sensors - Market size and forecast 2019-2024
  • Market opportunity by Device type

Market Segmentation by Packaging technology

  • Market segments
  • Comparison by Packaging technology
  • Flip chip - Market size and forecast 2019-2024
  • FI WLP - Market size and forecast 2019-2024
  • 2.5D/3D - Market size and forecast 2019-2024
  • FO WLP - Market size and forecast 2019-2024
  • Market opportunity by packaging technology

Customer landscape

  • Customer landscape

Geographic Landscape

  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2019-2024
  • North America - Market size and forecast 2019-2024
  • Europe - Market size and forecast 2019-2024
  • South America - Market size and forecast 2019-2024
  • MEA - Market size and forecast 2019-2024
  • Key leading countries
  • Market opportunity by geography

Market Drivers - Demand led growth

Market Challenges

Market Trends

Vendor Landscape

  • Vendor landscape
  • Landscape disruption

Vendor Analysis

  • Vendors covered
  • Market positioning of vendors
  • Amkor Technology Inc.
  • ASE Technology Holding Co. Ltd.
  • ChipMOS TECHNOLOGIES Inc.
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • King Yuan Electronic Co. Ltd.
  • Koch Industries Inc.
  • Samsung Electronics Co. Ltd.
  • Taiwan Semiconductor Manufacturing Co. Ltd.
  • UTAC Holdings Ltd.
  • Veeco Instruments Inc.

Appendix

  • Scope of the report
  • Currency conversion rates for US$
  • Research methodology
  • List of abbreviations

About Us

Technavio is a leading global technology research and advisory company. Their research and analysis focus on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions. With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

Release Summary

The Global Semiconductor Advanced Packaging Market will grow by USD 14.41 bn during 2020-2024

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/