Global Outsourced Semiconductor Assembly & Test (OSAT) Industry Developments, 2016-2020 - ResearchAndMarkets.com

DUBLIN--()--The "Recap and Outlook of Worldwide OSAT Industry in 2020" report has been added to ResearchAndMarkets.com's offering.

Affected by a slowdown in the global economy and sluggish demand in the consumer market, worldwide OSAT (Outsourced Semiconductor Assembly and Test) industry shipment value dropped by 1.93% YoY to US$28.893 billion in 2019.

The first half of 2019 suffered a more severe impact as downstream vendors pulled forward in the second half of 2018 and overall product sales declined last year. Despite a mild recovery in the end market in the second half, the OSAT industry still registered weaker revenue performance in the entire 2019 than in 2018.

This report reviews the shipment performance of the worldwide OSAT industry in 2019 and analyzes its development trends in 2020.

  • Development of the global OSAT industry, covering shipment value for the period 2016-2020
  • Development of leading OSAT vendors, including Amkor, JECT, Tianshui Huatian, and TongFu Microelectronics
  • Development of the Taiwanese OSAT industry, touching on the development of ASE, PTI, and KYEC

Key Topics Covered

1. Worldwide OSAT Shipment Value

1.1 Worldwide Shipment Value Picks Up in 2H19

1.2 Slight Shipment Value Growth Expected in 2020 due to COVID-19 Outbreak

1.3 Taiwan Takes Up the Largest Shipment Value Share in 2019, Followed by China

1.3.1 OSAT Vendor Rankings Remain Steady with KYEC and UTAC Switching Places

1.3.2 Taiwanese OSAT Industry Shipment Value Declines by 0.2% in 2019, Lower than Global Average

2. Leading International vendors Development

2.1 Amkor Revenue Declines in 2019 with Continued Focus on SiP

2.2 JCET Builds Advanced Bases via JV with Consistent Focus on High-end Packaging Technology

2.3 Acquisition of Unisem Benefits Tianshui Huatian's Business Performance in 2019

2.4 AMD's Strong Growth Drive TFME's Growth

3.Development of Taiwanese OSAT Vendors

3.1 ASE Continues to Expand Capacity with Strong Growth Momentum for SiP

3.1.1 Ongoing Acquisition and Capacity Expansion to Prepare for Massive Market Demand

3.1.2 SiP Still an Important Growth Driver

3.2 PTI Spreads Development Efforts across Advanced Packaging Technologies

3.3 KYEC Revenue Hits Record High on Strong 5G, AI, and CIS Testing Demand

4. Analyst's Perspective

Companies Mentioned

  • AMD
  • Amkor
  • Apple
  • ASE
  • ASML
  • Asteelflash
  • Broadcom
  • ChipBond Technology
  • ChipMOS
  • Fabtronic
  • Financiere AFG SAS
  • HiSilicon
  • Huawei
  • Intel
  • JCET
  • JSCK
  • KYEC
  • MediaTek
  • NXP
  • Powertech
  • Qorvo
  • Qualcomm
  • Samsung
  • Sigurd Group
  • Skyworks
  • SMIC
  • Sony
  • STATS ChipPAC
  • Tianshui Tuatian Technology
  • TongFu Microelectronics
  • Unisem
  • USI Electronics
  • UTAC

For more information about this report visit https://www.researchandmarkets.com/r/ayf7ie

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Contacts

ResearchAndMarkets.com
Laura Wood, Senior Press Manager
press@researchandmarkets.com

For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900