$425 Billion Worldwide Conventional and Advanced Packaging Market for IC Devices (2019 to 2023) - ResearchAndMarkets.com

DUBLIN--()--The "The Worldwide Conventional and Advanced Packaging Market for IC Devices" report has been added to ResearchAndMarkets.com's offering.

The Worldwide Conventional and Advanced Packaging Market for IC Devices examines the global marketplace of integrated circuits (ICs) and the many packaging designs developed for ICs. This comprehensive report presents a detailed analysis of a vast and vibrant IC market that is expected to reach $425 billion by 2023.

The 385-page report provides insightful analysis of major market trends affecting the IC industry and presents more than 170 tables quantifying both the IC devices and IC packaging markets. In addition, dozens of graphical figures provide an alternative perspective for understanding the underlying data.

The report provides extensive and detailed quantitative analysis with forecasts for unit shipments, revenues and package pricing for 30 separate IC device types as well as 14 major packaging categories comprising 44 IC packaging market segments. Also covered are advanced IC packaging market segments and interconnection solutions. Virtually every table presents year-end data for 2018, plus five-year forecasts from 2019 through 2023.

The report is arranged into six chapters. An Introductory chapter (Chapter 1) and the Executive Summary (Chapter 2) present a short overview of the report with a description of its major conclusions and methodology. The remaining chapters focus on four major topics of discussion.

The Worldwide Conventional and Advanced Packaging Market for IC Devices, 2019 Edition continues the publisher's leadership position in analyzing IC device markets and IC packaging products and technologies. This report is an effective and economical tool for any company interested in competing in the semiconductor industry or who may be simply looking for aid in assessing the present and future of this dynamic industry.

Key Topics Covered:

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Integrated Circuit Device Market Analysis

  • Worldwide Integrated Circuit Market
  • Total Market Forecasts
  • Regional Market Trends and Forecasts
  • Market Forecasts by Device Type
  • Processor Devices: MPUs, MCUs (4-bit, 8-bit, 16-bit, 32+-bit), DSPs
  • Memory Devices: DRAM, SRAM, Flash, ROM/EPROM, EEPROM and Other
  • Logic Devices: Digital Bipolar Devices, Standard Logic, Gate
  • Arrays, Standard Cell and PLDs, Display Drivers and Touch
  • Screen Controllers, Special-Purpose Logic (Consumer, Computers, Communications, Automotive, Multipurpose and Other)
  • Analog Devices: Amplifiers and Comparators, Interfaces, Voltage Regulators and References, Data Converters, Application-Specific Analog (Consumer, Computers, Communications, Automotive, Industrial and Other)

Chapter 4 IC Packaging Market Analysis

  • Worldwide IC Packaging Market
  • Total IC Packaging Market Forecasts
  • Package Pricing Trends
  • IC Packaging Market by I/O Count
  • IC Package Families Descriptions and Forecasts
  • Dual In-Line Packaging (DIP) Market
  • Transistor Outline Packaging (TO) Market
  • Small Outline Transistor (SOT) Packaging Market
  • Small Outline Packaging (SO) Market
  • Thin Small Outline Packaging (TSOP) Market
  • Chip Carrier (CC) Market
  • Quad Flat Pack (QFP) Market
  • Dual Flat Pack No-Lead Packaging (DFN) Market
  • Quad Flat Pack No-Lead Packaging (QFN) Market
  • Pin Grid Array Packaging (PGA) Market
  • Ball Grid Array Packaging (BGA) Market
  • Fine Pitch Ball Grid Array Packaging (FBGA) Market
  • Wafer-Level Packaging (WLP) Market
  • Direct Chip Attached (DCA) Market

Chapter 5 Advanced Packaging Markets

  • Total Advanced IC Packaging Market Forecasts
  • Fan-Out Wafer-Level Packaging
  • Conventional WLPs versus Fan-Out WLPs
  • Fan-Out WLP Market Trends and Forecasts
  • Multi-Row QFN Packaging Trends and Forecasts
  • Overview of Multichip Packaging Technology (MCP)
  • Topic covers: Types of Multichip Packages, Benefits and Shortcomings, Multichip Packaging Challenges and Solutions, Techniques for Wafer Thinning MCP Total Forecasts
  • Stacked Multichip Packaging Market Segments
  • Stacked TSOP Market Trends and Forecasts
  • Stacked QFN Market Trends and Forecasts
  • FBGA Market Trends and Forecasts
  • Stacked WLP Market Trends and Forecasts System-in-Package Market Segments
  • Total SiP Market Trends and Forecasts
  • Package-on-Package Market Forecasts
  • Package-in-Package Market Forecasts
  • Multichip Modules Market Forecasts
  • Stacked WLPs within SiPs Market Forecasts

Chapter 6 Interconnection Technologies and Solutions

  • Interconnection Technologies Overview
  • Interconnection Market Forecasts
  • Wire Bonding
  • Wire Bonding Methods
  • Wire Materials
  • Wire Bonding Market Trends and Forecasts
  • Flip Chip
  • The Flip Chip Process
  • Flip Chip Packaging Market Trends and Forecasts
  • Flip Chip Package Device Market Trends and Forecasts
  • Flip Chip Devices: MPUs, 32+-bit MCUs,
  • DSPs, Gate Arrays, Standard Cell and PLDs, Special-Purpose Logic (Consumer, Computer, Communications, Automotive, Multipurpose and Other), DRAM, SRAM, Flash, Application-Specific Analog (Computer, Communications)
  • Bare Die Flip Chip Market Trends and Forecasts Through-Silicon Vias
  • Forecasts of the Through-Silicon Via Market Segment

Appendix Glossary of IC Packaging Terms

For more information about this report visit https://www.researchandmarkets.com/r/fhqnhx

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Contacts

ResearchAndMarkets.com
Laura Wood, Senior Press Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900